




Liquid Gap Filler
導熱液態系列
流動性可填補微小間隙
Solid Gap Pad
導熱墊片系列
墊片、凝膠柔軟可壓縮
Absorber Filler
導熱吸波系列
兼具導熱和電磁波吸收
Thermal Tape
導熱膠帶系列
可應用在散熱片黏接
Thermal Insulation
導熱絕緣系列
適用於高溫設備絕緣
Thermal Break
斷熱材料系列
奈米級多孔結構
Lightweight
導熱低密度系列
輕量化導熱材料
Graphite
導熱石墨系列
高達1700W/m·K以上
Advance
特殊導熱材料
Silicone
矽型
Non-Silicone
非矽型
RBA ∣ ISO14001
∣
ISO/TS16949 ∣ IECQ080000
∣
ISO9001 ∣ UL
∣
Gap Pad
導熱墊片系列
Liquid Filler
導熱液態系列
Absorber Filler
導熱吸波系列
Thermal Tape
導熱膠帶系列
Thermal Insulation
導熱絕緣系列
Thermal Break
斷熱材料系列
Lightweight
導熱低密度系列
輕量化導熱材料
Graphite
導熱石墨系列
1700w/m·k以上
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Liquid Gap Filler
液態系列
Thermal
Solid GAP Filler
固態系列
Thermal
W/m*K | Solid Gap Pad | Liquid Gap Filler | Thermal Absorber | Thermal Tape | Thermal Insulated | Thermal Break | Thermal Lightweight | W/m*K |
0.009 | AS27-s | 0.009 | ||||||
0.028 | AS17-s | 0.028 | ||||||
0.55 | TPS31 | 0.55 | ||||||
0.8 | TPS589 | 0.8 | ||||||
0.9 | AT900A | 0.9 | ||||||
1.0 | AT910 | 1.0 | ||||||
1.2 | 1.2 | |||||||
1.3 | 1.3 | |||||||
1.5 | TPS586 | SH1500 | TPS32 | 1.5 | ||||
1.8 | ST6000-S | PR27 | 1.8 | |||||
2.0 | SH2000 | 2.0 | ||||||
2.2 | S393 | 2.2 | ||||||
2.5 | EP770-s | 2.5 | ||||||
3.0 | SH3000 | DTT44-s | 3.0 | |||||
3.2 | S818 | 3.2 | ||||||
3.5 | AT920-s | 3.5 | ||||||
3.6 | PK404DM | 3.6 | ||||||
4.0 | TIM14 | 4.0 | ||||||
4.5 | AS02-s | DCTP140-s | 4.5 | |||||
5.0 | DTT65-s | 5.0 | ||||||
6.0 | PK605 | TEM96E | 6.0 | |||||
7.0 | 7.0 | |||||||
8.0 | T-top81-s | SH-putty3 | 8.0 | |||||
9.0 | N800A-s | N-putty5-s | 9.0 | |||||
10.0 | S-putty5-s | 10.0 | ||||||
11.0 | 11.0 | |||||||
13.0 | DTT13-s | 13.0 | ||||||
15.0 | 15.0 | |||||||
17.0 | N800C-s | 17.0 | ||||||
18.0 | T-top98-s | 18.0 | ||||||
20.0 | T-work9000 | 20.0 | ||||||
24.0 | T-top99-s | 24.0 |
W/m*K | Solid Gap Pad | Liquid Gap Filler | Thermal Absorber | Thermal Tape | Thermal Insulated | Thermal Break | Thermal Lightweight | W/m*K |
W/m*K | Solid Gap Pad | Liquid Gap Filler | Thermal Absorber | Thermal Tape | Thermal Insulated | Thermal Break | Thermal Lightweight | W/m*K |