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New, Silicone・TIMs ——
DTT65-s Lightweight 5G mmWave Thermal Conductive Gel Pad
5.0W/m·K
Lightweight
Low-density thermal pad made from magnetic materials and silicone resin composite offers both high thermal conductivity and EMI absorption. It fills microscopic gaps between heat sources and heatsinks to reduce thermal resistance while suppressing chip-to-chip interference, enhancing signal quality and safety in medical equipment.
CATEGORY
FEATURES
/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m·K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| Property | DTT65-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Pink | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.1 | g/cm³ | ASTM D792 |
| Hardness | 55 | Shore OO | ASTM D2240 |
| Water absorption | 0.005 | % | ASTM D570 |
| Application temperature | -60～180 | °C | – |
| RoHS & REACH | Compliant | – | – |
| [email protected] | |||
| Deflection @10 psi | 8 | % | ASTM D5470 modify |
| Deflection @20 psi | 11 | % | ASTM D5470 modify |
| Deflection @30 psi | 16 | % | ASTM D5470 modify |
| Deflection @40 psi | 21 | % | ASTM D5470 modify |
| Deflection @50 psi | 26 | % | ASTM D5470 modify |
| ELECTRICAL | |||
| Dielectric breakdown | 10 | KV/mm | ASTM D149 |
| Surface resistivity | >1012 | Ohm | ASTM D257 |
| Volume resistivity | >1013 | Ohm-m | ASTM D257 |
| Dielectric constant@2GHz Dk | 4.131 | – | ASTM D150 |
| Dielectric constant@6GHz Dk | 4.058 | – | ASTM D150 |
| Dielectric constant@10GHz Dk | 4.013 | – | ASTM D150 |
| Dissipation factor@2GHz Df | 0.00509 | – | ASTM D150 |
| Dissipation factor@6GHz Df | 0.00658 | – | ASTM D150 |
| Dissipation factor@10GHz Df | 0.00780 | – | ASTM D150 |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.350 | °C·in²/W | ASTM D5470 |
| Thermal impedance@20 psi | 0.342 | °C·in²/W | ASTM D5470 |
| Thermal impedance@30 psi | 0.323 | °C·in²/W | ASTM D5470 |
| Thermal impedance@40 psi | 0.302 | °C·in²/W | ASTM D5470 |
| Thermal impedance@50 psi | 0.281 | °C·in²/W | ASTM D5470 |
