Ultra3065 delivers a high thermal conductivity of 30.0 W/m·K. Its excellent compressibility and conformability accommodate component height variations and uneven surfaces, while Shore OOO 65 hardness balances surface conformity with mechanical support. It also provides excellent electrical insulation, with a dielectric breakdown strength of 9 kV/mm, making it suitable for high-density electronic assemblies. Custom thicknesses and dimensions are available for AI servers, GPUs, CPUs, HBM packages, power modules, and other high-power applications.

LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.

This product is a high thermal conductivity liquid material designed for AI chip cooling, offering excellent gap-filling capability and heat-curable properties to effectively reduce junction temperatures in high-performance computing systems. Its stable material structure makes it an ideal thermal interface material for immersion cooling, maintaining consistent thermal performance under prolonged liquid exposure and thermal cycling conditions.

DTT54-s features a thermal conductivity of 4.0 W/m·K and provides a structurally stable, high-performance thermal interface layer. It is designed for use between chips and cold plates or other heat dissipation structures, forming a low thermal interface resistance and a long-term reliable heat transfer path to effectively reduce junction temperatures. Even under prolonged immersion in cooling fluids, the material resists loss, displacement, and performance degradation, ensuring stable and reliable thermal performance during long-term operation.

Thermal pads for single-phase immersion cooling feature optimized chemical formulations tested for durability and high-temp operation. Designed for high-power uses like AI servers and data centers, they improve thermal management and system stability.

The fiberglass Cloth reinforced Thermal Pads use glass fiber cloth filled with thermally conductive compounds, combining strength and heat conduction for electronics heat transfer and insulation.

Multifunctional Thin Thermal EMI Absorber Film as an innovative functional composite material, offer modern electronic engineering an effective solution to tackle both heat dissipation and EMI challenges simultaneously.

A Thermally Conductive EMI Absorption Pad is a composite material that combines high-efficiency heat dissipation and electromagnetic wave absorption capabilities. It fills thermal interface gaps between electronic components and heat sinks, while its absorber layer reduces reflection and resonance within specific frequency bands to suppress electromagnetic interference (EMI)。

This new glass-fiber thermal pad incorporates glass fibers into a silicone substrate, offering both high thermal conductivity and outstanding mechanical strength, suitable for high-insulation, high-vibration, and harsh environments.