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TPS586
1.5 W/m·K
Encapsulants
TPS586 motor potting compound is primarily used to protect electric motor components against environmental factors such as dust, moisture, and vibration. It fills internal voids within the motor, enhancing mechanical strength and insulation performance while reducing noise and vibration. Unlike conventional potting compounds, TPS586 thermally conductive motor potting compound effectively transfers heat generated during motor operation, lowering component temperatures and extending service life.
CATEGORY
Encapsulants
FEATURES
CONFIGURATIONS
TPS586 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
- Automotive electronics
- Telecommunication hardware
- Computer and peripherals
- 5G base station & infrastructure
- Between any heat-generating component and a heat sink
- EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS586 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White-A Gray-B | - | Visual |
| Resin Base | Silicone | - | - |
| A:B | 100:100 | - | - |
| Viscosity | 5.7 | Pa.s | ISO 3219 |
| Density | 2.3 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 10 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.5 | W/m·K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹² | Ohm-m | ASTM D257 |
Related Products
TPS589
0.8 W/m·K
Encapsulants
TPS5868
3.0 W/m·K
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TPS586
1.5 W/m·K
Encapsulants