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    • Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.
      TPS586 是可以在室溫或高溫下固化雙劑導熱灌封膠,灌封膠是液體流動性導熱膠,可填滿電子器件周圍空氣空間的縫隙,固化後與發熱的電子元件和散熱器保持密切接觸,使電子產品能夠在高功率下運行進行熱傳導,熱傳導係數:1.5 W/m*K的間隙填充材料。

      Liquid series

      High-Flow gap fillers fully cover irregular surfaces, unlike thermal pads.

      Solid series

      Including high ductile, ultra-thin, ultra-soft, and low-bleed Thermal pads.

      EMI Shielding Pad

      Thermal conductive & RF absorption, enhancing product reliability.

      Tape series

      Reduces heatsink bonding steps while solving fixation and thermal issues.

      Lightweight series

      Reduce device weight while offering high thermal conductivity.

      Electrical insulator

      Ideal for applications needing both thermal and electrical solutions.

      Graphite Sheets

      Ultra-thin, flexible, perfect for space-saving & high-performance devices.

      Thermal Break

      Lightweight composite withstands 1300°C to prevent thermal runaway.

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      Shiu Li Technology is committed to yearly launches of new innovations, delivering excitement. More than grand events, these launches showcase our strength. With our team's breakthroughs, your products will set trends—this is Shiu Li Technology's power!

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      Development

      In line with technological development trends and the global environmental protection movement, we continuously deliver outstanding R&D outputs in product and process development.

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      Material Analysis

      Control of hazardous substances in accordance with customer and environmental requirements.

      Reliability Laboratory

      Effectively control and prevent all potential quality issues that may occur.

      Manufacture

      Cleanrooms, automated equipment, and diverse molding technologies.

      Patents

      Holds multiple global patents for thermal conductive materials.

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      About Us

      LiPOLY® TIMs Technology possesses profound technical expertise and extensive application experience, with top-tier talent from diverse fields dedicated to developing high-performance thermal management and innovative materials. Equipped with state-of-the-art laboratory facilities and automated manufacturing equipment, we conduct high-precision testing and analysis to ensure product stability and reliability.

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      Professional Quality

      We maintain a comprehensive quality management system and have obtained international certifications.

      Company History

      In June 2002, we developed and manufactured the first batch of K0.8 to K3 thermally conductive materials.

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      Holds multiple global patents for thermal conductive materials.

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TPS586 是可以在室溫或高溫下固化雙劑導熱灌封膠,灌封膠是液體流動性導熱膠,可填滿電子器件周圍空氣空間的縫隙,固化後與發熱的電子元件和散熱器保持密切接觸,使電子產品能夠在高功率下運行進行熱傳導,熱傳導係數:1.5 W/m*K的間隙填充材料。

TPS586

NT$129

Motor potting compound is primarily used to protect electric motor components from environmental factors such as dust, moisture, and vibration. It fills internal gaps within the motor, enhances mechanical strength and insulation performance, and reduces noise and vibration. Unlike general potting compounds, thermally conductive motor potting compound effectively dissipates heat generated during motor operation, lowers component temperature, and extends service life.

SKU: TPS586 Category:Encapsulants Tag:Silicone・TIMs
  • Additional information

Additional information

Weight 0.5 kg
Dimensions 1 × 2 × 3 cm

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LiPOLY® TIMs Technology

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TEL: 03-3788588

FAX: 03-3788288

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LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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03-3788588
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