RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Non-silicone Liquid Gap Filler

Non-silicone liquid thermal interface material is a liquid or semi-liquid thermal conductive material that does not contain siloxane, mainly used for thermal management of high-precision electronic components or optical devices. It features excellent thermal conductivity and conformability, effectively filling the gaps between heat-generating components and heat sinks, while avoiding the issues of volatilization, contamination, or outgassing that may occur with traditional silicone-based materials.

Thermal Putty

N-putty5

9.0 W/m·K
Low outgassing
No Vertical Flow

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow

G3380NT

6.0 W/m·K
Low outgassing
Low minimum bond line

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line

NEP230

3.0 W/m·K
Low outgassing
Adhesive

EP770

2.5 W/m·K
Low outgassing
Encapsulants

NEP220

2.2 W/m·K
Low outgassing
Adhesive

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line

N-putty5

9.0 W/m·K
Low outgassing
No Vertical Flow

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow

G3380NT

6.0 W/m·K
Low outgassing
Low minimum bond line

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line

NEP230

3.0 W/m·K
Low outgassing
Adhesive

EP770

2.5 W/m·K
Low outgassing
Encapsulants

NEP220

2.2 W/m·K
Low outgassing
Adhesive

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line

N-putty5

9.0 W/m·K
Low outgassing
No Vertical Flow

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow

G3380NT

6.0 W/m·K
Low outgassing
Low minimum bond line

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line

NEP230

3.0 W/m·K
Low outgassing
Adhesive

EP770

2.5 W/m·K
Low outgassing
Encapsulants

NEP220

2.2 W/m·K
Low outgassing
Adhesive

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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