RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Non-silicone Liquid Gap Filler

Non-silicone liquid thermal interface material is a liquid or semi-liquid thermal conductive material that does not contain siloxane, mainly used for thermal management of high-precision electronic components or optical devices. It features excellent thermal conductivity and conformability, effectively filling the gaps between heat-generating components and heat sinks, while avoiding the issues of volatilization, contamination, or outgassing that may occur with traditional silicone-based materials.

Thermal Putty
7.0 W/m·K
Low outgassing
No Vertical Flow
6.0 W/m·K
Low outgassing
Low minimum bond line
5.0 W/m·K
Low outgassing
No Vertical Flow
4.5 W/m·K
Low outgassing
Low minimum bond line
3.5 W/m·K
Low outgassing
No Vertical Flow
3.2 W/m·K
Low outgassing
Low minimum bond line
2.5 W/m·K
Low outgassing
Encapsulants
1.3 W/m·K
Low outgassing
Low minimum bond line
7.0 W/m·K
Low outgassing
No Vertical Flow
6.0 W/m·K
Low outgassing
Low minimum bond line
5.0 W/m·K
Low outgassing
No Vertical Flow
4.5 W/m·K
Low outgassing
Low minimum bond line
3.5 W/m·K
Low outgassing
No Vertical Flow
3.2 W/m·K
Low outgassing
Low minimum bond line
2.5 W/m·K
Low outgassing
Encapsulants
1.3 W/m·K
Low outgassing
Low minimum bond line
7.0 W/m·K
Low outgassing
No Vertical Flow
6.0 W/m·K
Low outgassing
Low minimum bond line
5.0 W/m·K
Low outgassing
No Vertical Flow
4.5 W/m·K
Low outgassing
Low minimum bond line
3.5 W/m·K
Low outgassing
No Vertical Flow
3.2 W/m·K
Low outgassing
Low minimum bond line
2.5 W/m·K
Low outgassing
Encapsulants
1.3 W/m·K
Low outgassing
Low minimum bond line

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

Contact Us

Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.