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Non-silicone Liquid Gap Filler

Non-silicone liquid thermal interface material is a liquid or semi-liquid thermal conductive material that does not contain siloxane, mainly used for thermal management of high-precision electronic components or optical devices. It features excellent thermal conductivity and conformability, effectively filling the gaps between heat-generating components and heat sinks, while avoiding the issues of volatilization, contamination, or outgassing that may occur with traditional silicone-based materials.

Thermal Putty
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.

N-putty5

9.0 W/m·K
Low outgassing
No Vertical Flow
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.

G3380NT

6.0 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying.

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow
G3380NJ散熱膏外包裝

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

NEP230

3.0 W/m·K
Low outgassing
Adhesive
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.

EP770

2.5 W/m·K
Low outgassing
Encapsulants
散熱膠，又稱為導熱膠，是具有良好熱傳導能力的黏合劑，常用於電子元件與散熱片之間的接合。能有效填補元件間的空隙，確保熱能高效傳遞。與散熱膏不同，散熱膠具有黏性，能將兩個表面黏合在一起，提供機械固定，無需額外的緊固件。 NEP220 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

NEP220

2.2 W/m·K
Low outgassing
Adhesive
G3380NA非矽型散熱膏

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.

N-putty5

9.0 W/m·K
Low outgassing
No Vertical Flow
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.

G3380NT

6.0 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying.

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow
G3380NJ散熱膏外包裝

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

NEP230

3.0 W/m·K
Low outgassing
Adhesive
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.

EP770

2.5 W/m·K
Low outgassing
Encapsulants
散熱膠，又稱為導熱膠，是具有良好熱傳導能力的黏合劑，常用於電子元件與散熱片之間的接合。能有效填補元件間的空隙，確保熱能高效傳遞。與散熱膏不同，散熱膠具有黏性，能將兩個表面黏合在一起，提供機械固定，無需額外的緊固件。 NEP220 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

NEP220

2.2 W/m·K
Low outgassing
Adhesive
G3380NA非矽型散熱膏

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.

N-putty5

9.0 W/m·K
Low outgassing
No Vertical Flow
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow
G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.

G3380NT

6.0 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying.

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow
G3380NJ散熱膏外包裝

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

NEP230

3.0 W/m·K
Low outgassing
Adhesive
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.

EP770

2.5 W/m·K
Low outgassing
Encapsulants
散熱膠，又稱為導熱膠，是具有良好熱傳導能力的黏合劑，常用於電子元件與散熱片之間的接合。能有效填補元件間的空隙，確保熱能高效傳遞。與散熱膏不同，散熱膠具有黏性，能將兩個表面黏合在一起，提供機械固定，無需額外的緊固件。 NEP220 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

NEP220

2.2 W/m·K
Low outgassing
Adhesive
G3380NA非矽型散熱膏

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line

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Product News | N700C, N800A, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.