RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Thermal gel is a type of thermal interface material (TIM) used to fill microscopic gaps between electronic components-such as CPUs and GPUs-and heat sinks. By efficiently conducting heat, thermal gel helps reduce component temperatures, prevents overheating and performance degradation, and is an ideal choice for automated dispensing production using LiPOLY’s dedicated putty smart machine.
Thermal gel is a type of thermal interface material (TIM) used to fill microscopic gaps between electronic components-such as CPUs and GPUs-and heat sinks. By efficiently conducting heat, thermal gel helps reduce component temperatures, prevents overheating and performance degradation, and is an ideal choice for automated dispensing production using LiPOLY’s dedicated putty smart machine.

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S-putty
3.5 W/m·K
No Vertical Flow
LiPoly S-Putty thermal putty fills micro gaps between CPUs, GPUs & heat sinks. Ideal for automated dispensing. 10,987 impressions — trusted by engineers.
Datasheet Download

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 3.5 W/m·K
/ Bond line thickness：100~1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

N-putty3點膠機

TYPICAL PROPERTIES

PROPERTY S-putty UNIT TEST METHOD
Color Blue - Visual
Resin Base Silicone - -
Viscosity 2000 Pa.s DIN 53018
Flow Rate 31 g/min By LiPOLY
Density 3.0 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond Line Thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.5 W/m·K ASTM D5470
Thermal impedance@10psi / 60°C 0.079 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.061 °C-in²/ W ASTM D5470

Thermal Paste Related Products

Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m·K
No Vertical Flow
S-putty5-s
10.0 W/m·K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m·K
No Vertical Flow
S-putty
3.5 W/m·K
No Vertical Flow
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m·K
No Vertical Flow

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    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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