RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

Ultra High Thermal Conductive Pad

Ultra3065

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s

24.0 W/m·K
High Thermal Conductive
T-work9000 矽膠導熱片可依需求客製化厚度與沖型

T-work9000

20.0 W/m·K
High Thermal Conductive
T-top98-s 超高導熱墊片

T-top98-s

18.0 W/m·K
High Thermal Conductive
極高導熱矽膠片T-work8000

T-work8000

15.0 W/m·K
High Thermal Conductive
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.

DTT13-s

13.0 W/m·K
No Vertical Flow
T-top91-s 極高導熱係數導熱片

T-top91-s

13.0 W/m·K
High Thermal Conductive
T-work7000 Thermal Resistance vs. Pressure vs. Compression

T-work7000

11.0 W/m·K
High Thermal Conductive
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.

DTT10-s

10.0 W/m·K
No Vertical Flow

S-putty5-s

10.0 W/m·K
No Vertical Flow
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.

SH-putty3

8.0 W/m·K
No Vertical Flow
超高導熱係數墊片T-top81-s

T-top81-s

8.0 W/m·K
High Thermal Conductive

AS02-s

4.5 W/m·K
厚度 0.15 / 0.20 mm

AS200-s

2.0 W/m·K
Oil bleed width < 1mm

AS400-s

4.0 W/m·K
Oil bleed width < 1mm

AS50-s

5.0 W/m·K
Fiberglass reinforced
Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.

BS75K-s

3.0 W/m·K
Shore OO/18

BS87-s

3.0 W/m·K
Shore OO/10

BS89-s

5.0 W/m·K
Shore OO/25

DCTP140-s

4.5 W/m·K
Fiberglass reinforced
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation.

DTT04-s

4.0 W/m·K
No Vertical Flow
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.

DTT06-s

6.0 W/m·K
No Vertical Flow
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.

DTT10-s

10.0 W/m·K
No Vertical Flow
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.

DTT13-s

13.0 W/m·K
No Vertical Flow

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.