RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

T-top99-s

T-top99-s

24.0 W/m·K
Extreme Series

T-top99-s

T-top99-s

T-top99-s
T-work9000 矽膠導熱片可依需求客製化厚度與沖型

T-work9000

20.0 W/m·K
Extreme Series

T-work9000

T-work9000

T-work9000 矽膠導熱片可依需求客製化厚度與沖型
T-top98-s 超高導熱墊片

T-top98-s

18.0 W/m·K
Extreme Series

T-top98-s

T-top98-s

T-top98-s 超高導熱墊片
極高導熱矽膠片T-work8000

T-work8000

15.0 W/m·K
Extreme Series

T-work8000

T-work8000

極高導熱矽膠片T-work8000
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.

DTT13-s

13.0 W/m·K
No Vertical Flow

DTT13-s

DTT13-s

Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
T-top91-s 極高導熱係數導熱片

T-top91-s

13.0 W/m·K
Extreme Series

T-top91-s

T-top91-s

T-top91-s 極高導熱係數導熱片
T-work7000 Thermal Resistance vs. Pressure vs. Compression

T-work7000

11.0 W/m·K
Extreme Series

T-work7000

T-work7000

T-work7000 Thermal Resistance vs. Pressure vs. Compression

S-putty5-s

10.0 W/m·K
No Vertical Flow

S-putty5-s

S-putty5-s

Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.

DTT10-s

10.0 W/m·K
No Vertical Flow

DTT10-s

DTT10-s

Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
超高導熱係數墊片T-top81-s

T-top81-s

8.0 W/m·K
Extreme Series

T-top81-s

T-top81-s

超高導熱係數墊片T-top81-s
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.

SH-putty3

8.0 W/m·K
No Vertical Flow

SH-putty3

SH-putty3

Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.

PK700DM

7.0 W/m·K
Fast Curing in room temperature

PK700DM

PK700DM

AS02-s

4.5 W/m·K
厚度 0.15 / 0.20 mm

AS02-s

AS02-s

AS200-s

2.0 W/m·K
Oil bleed width < 1mm

AS200-s

AS200-s

AS400-s

4.0 W/m·K
Oil bleed width < 1mm

AS400-s

AS400-s

AS50-s

5.0 W/m·K
Fiberglass reinforced

AS50-s

AS50-s

Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.

BS75K-s

3.0 W/m·K
Shore OO/18

BS75K-s

BS75K-s

Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.

BS87-s

3.0 W/m·K
Shore OO/10

BS87-s

BS87-s

BS89-s

5.0 W/m·K
Shore OO/25

BS89-s

BS89-s

DCTP140-s

4.5 W/m·K
Fiberglass reinforced

DCTP140-s

DCTP140-s

DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。

DTT04-s

4.0 W/m·K
No Vertical Flow

DTT04-s

DTT04-s

DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.

DTT06-s

6.0 W/m·K
No Vertical Flow

DTT06-s

DTT06-s

The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.

DTT10-s

10.0 W/m·K
No Vertical Flow

DTT10-s

DTT10-s

Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.

DTT13-s

13.0 W/m·K
No Vertical Flow

DTT13-s

DTT13-s

Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.

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