Paste
Pad
Absorber
Tape
Light
Insulator
Graphite
Break
G3380T
6.0 W/m·K
Low minimum bond line
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.
CATEGORY
FEATURES
- Thermal Conductivity：6.0 W/m·K
- Low Thermal Resistance
- Can be applied manually dispensed or screen printed
- Low minimum bond line
CONFIGURATIONS
- Tinplate Can:1kg
- Other sizes, colors, and custom specifications are available upon request. Please contact:[email protected]
TYPICAL APPLICATION
- LED appliance
- EV electric vehicle
- CPU and chip coolers
- Switching power supplies
- 5G base station & infrastructure
- Between any heat-generating component and heat sink
G3380 Thermal Paste Series
- G3380A：1.3 W/m·K(Non-silicone series G3380NA)
- G3380B：3.2 W/m·K(Non-silicone series G3380NJ)
- G3380K：4.5 W/m·K(Non-silicone series G3380NK)
- G3380T：6.0 W/m·K(Non-silicone series G3380NT)
What Is the Difference Between Silicone and Non-Silicone Thermal Paste?
Most thermal pastes are silicone-based. However, silicone releases siloxane at high temperatures, which in enclosed environments can adhere to electrical contacts and cause malfunctions. LiPOLY Technology has developed a non-silicone thermal paste that does not release low molecular weight siloxane. This contamination-free thermal paste has become the preferred choice for EU aerospace, military, and medical device industries. Feel free to browse our products, or contact us directly .
G3380 Non-Silicone Thermal Paste Series
TYPICAL PROPERTIES
| PROPERTY | G3380T | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 181 | Pa.s | ISO 3219 |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Bond Line Thickness | 30 | µm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.01 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 6.4 | °C-mm²/ W | ASTM D5470 |
