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G3380NK
4.5 W/m·K
Low outgassing
Low minimum bond line
The non-silicone thermal paste G3380NK is particularly suited for optical, medical, semiconductor, and high-end electronics applications that are sensitive to siloxane outgassing or require high cleanliness and reliability. When applied to the CPU surface, it effectively eliminates excess air between the processor and heat sink, delivering high-efficiency thermal conductivity that enables heat generated by the CPU to transfer to the heat sink more rapidly, thereby enhancing the overall thermal performance of the system.
CATEGORY
FEATURES
- Thermal Conductivity: 4.5 W/m·K
- No Low Molecular Weight Siloxane Outgassing
- Low Thermal Resistance
- It can be preserved for 60 months under the condition of unopened and under room temperature 25℃.
CONFIGURATIONS
- Tinplate Can:1kg
- Other sizes, colors, and custom specifications are available upon request. Please contact:[email protected]
TYPICAL APPLICATION
- Between CPU and heat sink
- Switching power supplies
- LED appliance
- Between any heat-generating component and a heat sink
- 5G base station & infrastructure
- EV electric vehicle
G3380 Non-Silicone Thermal Paste Series
- G3380NA: 1.3 W/m·K (Silicone : G3380A)
- G3380NJ: 3.2 W/m·K (Silicone : G3380B)
- G3380NK: 4.5 W/m·K (Silicone : G3380K)
- G3380NT: 6.0 W/m·K (Silicone : G3380T)
What Is Non-Silicone Thermal Paste?
Non-silicone thermal paste does not release low molecular weight siloxane. This contamination-free material, which eliminates the risk of electrical contact failure, has gained widespread adoption across EU industries in recent years. LiPOLY Technology offers a complete product line of both silicone and non-silicone thermal pastes across various thermal conductivity ratings. Feel free to browse our products, or contact us directly .
G3380 Non-Silicone Paste Series
TYPICAL PROPERTIES
| PROPERTY | G3380NK | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Non-Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 106 | ISO 3219 | |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond Line Thickness | 27 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 4.5 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.02 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 12.9 | °C-mm²/ W | ASTM D5470 |
Related Products
G3380NT
6.0 W/m·K
Low outgassing
Low minimum bond line
G3380NK
4.5 W/m·K
Low outgassing
Low minimum bond line
G3380NJ
3.2 W/m·K
Low outgassing
Low minimum bond line
G3380NA
1.3 W/m·K
Low outgassing
Low minimum bond line