Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TPS589
0.8 W/m·K
Encapsulants
TPS589 is a polymer-based electronic potting compound used to coat, protect, and secure electronic components during assembly. It plays a critical role in enhancing the reliability, durability, and protection of electronic products. As a liquid, flowable thermally conductive adhesive, TPS589 fills the air gaps surrounding electronic components. Once cured, it maintains intimate contact with heat-generating components and heat sinks, enabling efficient heat conduction at high power operation.
CATEGORY
Encapsulants
FEATURES
CONFIGURATIONS
TPS589 The principle of moisture hardening is to harden by reacting with moisture in the air at room temperature. The hardening process starts from the surface in contact with the air and hardens in the deep direction, so the hardening process is a little slow. The speed of hardening is related to temperature and humidity. When there is not enough water vapor in the use environment to react, it may not be completely hardened.
TYPICAL APPLICATION
- Automotive electronics
- Telecommunication hardware
- Computer and peripherals
- Between any heat-generating component and a heat sink
- 5G base station & infrastructure
- EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS589 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Resin Base | Silicone | - | - |
| A:B | 100:3 | - | - |
| Viscosity | 5.0 | Pa.s | ISO 3219 |
| Density | 1.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 50 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 0.8 | W/m·K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹¹ | Ohm-m | ASTM D257 |
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0.8 W/m·K
Encapsulants
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