Paste
Pad
Absorber
Tape
Light
Insulator
Graphite
Break
N800B
13.0W/m·K
Low outgassing
ASTM E595
Non-Silicone thermal pads prevent outgassing, critical for thermal management in optical, medical, and semiconductor applications where silicone sensitivity exists. High temperatures or enclosed spaces cause silicone compounds to vaporize, forming insulating films on contacts, lenses, and sensors, which impair electrical connectivity, signal transmission, and light transmission, ultimately causing malfunctions and reduced lifespan.
CATEGORY
FEATURES
/ Thermal conductivity：13.0 W/m・K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ High speed mass storage drives
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| Property | N800B | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Application temperature | -60～130 | °C | – |
| Low molecular Siloxane(D3 to D20 total) | N.D | % | Gas Chromatography |
| Total Mass Loss (TML) | ≤ 1.0 | % | ASTM E595 |
| Collected Volatile Condensable Materials （CVCM） | ≤ 0.1 | % | ASTM E595 |
| Water Vapor Regained（WVR） | ≤ 0.02 | % | ASTM E595 |
| RoHS & REACH | Compliant | – | – |
| [email protected] | |||
| Deflection @10 psi | 12 | % | ASTM D5470 modify |
| Deflection @20 psi | 32 | % | ASTM D5470 modify |
| Deflection @30 psi | 63 | % | ASTM D5470 modify |
| ELECTRICAL | |||
| Dielectric breakdown | 8 | kV/mm | ASTM D149 |
| Surface resistivity | >1011 | Ohm | ASTM D257 |
| Volume resistivity | >1010 | Ohm-m | ASTM D257 |
| THERMAL | |||
| Thermal conductivity | 13.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.183 | °C·in²/W | ASTM D5470 |
| Thermal impedance@20 psi | 0.131 | °C·in²/W | ASTM D5470 |
| Thermal impedance@30 psi | 0.074 | °C·in²/W | ASTM D5470 |
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