RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

PK605

6.0 W/m·K
General Series
Thermal pad PK605 is a material specifically engineered for high-efficiency heat transfer, designed to reduce interfacial thermal resistance between heat sources and heat sinks. It is widely used across applications ranging from CPU/GPU cooling to automotive electronics, and is also suitable for medical devices and food machinery. Compliant with RoHS directives and REACH regulations, its Shore OO/60 hardness delivers exceptional flexibility, compressibility, electrical insulation, and self-adhesive properties, effectively compensating for positive and negative mechanical tolerances. Custom cutting and die-cutting services are also available.

CATEGORY

FEATURES

  • Thermal Conductivity:6.0 W/m·K
  • Natural tack for easy process application
  • Extremely low thermal impedance
  • Available in a range of thicknesses

CONFIGURATIONS

  • Roll form
  • Sheets form
  • Die-cuts parts

TYPICAL APPLICATION

  • Notebook computers
  • Heat pipe assemblies
  • Memory modules
  • TV hardware
  • Automotive electronics
  • Mobile devices
  • High speed mass storage drives
  • Set-top box
  • IP CAM
  • 5G base station & infrastructure
  • EV electric vehicle
Thermal Pads with Other Thermal Conductivity Ratings
Ultra-High Thermal Conductivity Thermal Pad

Thermal Resistance vs. Pressure vs. Deflection

PK605導熱片 熱阻抗 vs. 壓力值 vs. 變形量

TYPICAL PROPERTIES

PROPERTY PK605 UNIT TEST METHOD
Color Red - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.2 g/cm³ ASTM D792
Hardness 60 Shore OO ASTM D2240
Application temperature -60~180 °C -
Dielectric breakdown 12 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m·K ASTM D5470
Thermal impedance@10 psi 0.371 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.262 °C-in²/ W ASTM D5470

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