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Thermal Pad

Thermal pads are solid insulating materials with high-efficiency heat dissipation performance. They work by filling the microscopic air gaps formed by surface roughness between heat-generating components and heat sinks, significantly reducing contact thermal resistance. LiPOLY offers thermal pads in a variety of specifications — samples are available upon request.

Ultra High Thermal Conductive Pad

Ultra3065

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s

24.0 W/m·K
High Thermal Conductive
T-work9000 矽膠導熱片可依需求客製化厚度與沖型

T-work9000

20.0 W/m·K
High Thermal Conductive
T-top98-s 超高導熱墊片

T-top98-s

18.0 W/m·K
High Thermal Conductive
極高導熱矽膠片T-work8000

T-work8000

15.0 W/m·K
High Thermal Conductive
T-top91-s 極高導熱係數導熱片

T-top91-s

13.0 W/m·K
High Thermal Conductive
T-work7000 Thermal Resistance vs. Pressure vs. Compression

T-work7000

11.0 W/m·K
High Thermal Conductive
超高導熱係數墊片T-top81-s

T-top81-s

8.0 W/m·K
High Thermal Conductive
PK700導熱矽膠片

PK700

7.0 W/m·K
General
DTT61-s is a thermal pad compatible with single-phase immersion cooling, certified by Engineered Fluids for long-term immersion environment resistance. It prevents coolant contamination and maintains high thermal conductivity characteristics while providing local isolation effects that offer an additional protective layer for electronic components, enhancing overall system stability. Customizable sizing and die-cutting are available.

DTT61-s

6.0 W/m·K
Single-Phase Immersion Cooling
PK605 導熱片

PK605

6.0 W/m·K
General
導熱矽膠PK504可根據客戶需求沖型，客製化厚度、硬度

PK504

5.0 W/m·K
General

N800C

17.0 W/m·K
Low outgassing
ASTM E595
Non-Silicone Thermal Pads, also known as silicone-free thermal pads, are specifically designed to avoid siloxane volatilization and silicone oil bleeding issues, making them suitable for silicone-sensitive applications such as optical, medical, and precision electronics industries. Although the cost is higher, they effectively prevent contamination and failure risks associated with silicone-based materials.

N800CH

15.0 W/m·K
Low outgassing

N800B

13.0 W/m·K
Low outgassing
ASTM E595

N800BH

11.0 W/m·K
Low outgassing

N800A-s

9.0 W/m·K
Low outgassing
ASTM E595
LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.

PCM900

9.0 W/m·K
Phase Change Materials

N800AH

7.0 W/m·K
Low outgassing

N700C

5.0 W/m·K
Low outgassing
ASTM E595

N700B

3.0 W/m·K
Low outgassing
Ultra High Thermal Conductive Pad

Ultra3065

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s

24.0 W/m·K
High Thermal Conductive
T-work9000 矽膠導熱片可依需求客製化厚度與沖型

T-work9000

20.0 W/m·K
High Thermal Conductive
T-top98-s 超高導熱墊片

T-top98-s

18.0 W/m·K
High Thermal Conductive

N800C

17.0 W/m·K
Low outgassing
ASTM E595
極高導熱矽膠片T-work8000

T-work8000

15.0 W/m·K
High Thermal Conductive
Non-Silicone Thermal Pads, also known as silicone-free thermal pads, are specifically designed to avoid siloxane volatilization and silicone oil bleeding issues, making them suitable for silicone-sensitive applications such as optical, medical, and precision electronics industries. Although the cost is higher, they effectively prevent contamination and failure risks associated with silicone-based materials.

N800CH

15.0 W/m·K
Low outgassing

N800B

13.0 W/m·K
Low outgassing
ASTM E595
T-top91-s 極高導熱係數導熱片

T-top91-s

13.0 W/m·K
High Thermal Conductive

N800BH

11.0 W/m·K
Low outgassing
T-work7000 Thermal Resistance vs. Pressure vs. Compression

T-work7000

11.0 W/m·K
High Thermal Conductive
LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.

PCM900

9.0 W/m·K
Phase Change Materials

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.