RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Solid series

Explore LiPoly's full range of thermal gap fillers — silicone & non-silicone options for EV, AI server, aerospace & 5G applications. Request a sample today.

T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.
T-top99-s
24.0 W/m·K
Extreme Series
T-work9000
20.0 W/m·K
Extreme Series
T-top98-s
18.0 W/m·K
Extreme Series
T-work8000
15.0 W/m·K
Extreme Series
T-top91-s
13.0 W/m·K
Extreme Series
T-work7000
11.0 W/m·K
Extreme Series
T-top81-s
8.0 W/m·K
Extreme Series
PK700 thermal pad is a thermal interface material (TIMs) designed to reduce thermal interface resistance between heat sources and heat sinks, with wide applications from CPU/GPU cooling to automotive electronics. Compliant with RoHS/REACH , it is also suitable for medical equipment/food machinery. With Shore OO/55 hardness, it offers excellent flexibility, compressibility, insulation properties, and available with customized cutting and die-cutting services.
PK700
7.0 W/m·K
General Series
PK605
6.0 W/m·K
General Series
AS50-s
5.0 W/m·K
Fiberglass reinforced
BS89-s
5.0 W/m·K
Shore OO/25
PK504
5.0 W/m·K
General Series
N800C
17.0 W/m·K
Low outgassing
不含矽的導熱墊片（Non-Silicone Thermal Pad），稱作非矽型導熱墊片，是專為避免矽氧烷（Siloxane）揮發及矽油析出問題而設計，適合對矽敏感的產品應用，如光學、醫療、精密電子等領域。雖然成本較高，但能有效避免矽型材料帶來的污染與故障風險。
N800CH
15.0 W/m·K
Low outgassing
N800B
13.0 W/m·K
Low outgassing
N800BH
11.0 W/m·K
Low outgassing
N800A
9.0 W/m·K
Low outgassing
N800AH
7.0 W/m·K
Low outgassing
N700C
5.0 W/m·K
Low outgassing
N700B
3.0 W/m·K
Low outgassing
N700A
2.5 W/m·K
Low outgassing
T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.
T-top99-s
24.0 W/m·K
Extreme Series
T-work9000
20.0 W/m·K
Extreme Series
T-top98-s
18.0 W/m·K
Extreme Series
N800C
17.0 W/m·K
Low outgassing
T-work8000
15.0 W/m·K
Extreme Series
不含矽的導熱墊片（Non-Silicone Thermal Pad），稱作非矽型導熱墊片，是專為避免矽氧烷（Siloxane）揮發及矽油析出問題而設計，適合對矽敏感的產品應用，如光學、醫療、精密電子等領域。雖然成本較高，但能有效避免矽型材料帶來的污染與故障風險。
N800CH
15.0 W/m·K
Low outgassing
N800B
13.0 W/m·K
Low outgassing
T-top91-s
13.0 W/m·K
Extreme Series
N800BH
11.0 W/m·K
Low outgassing
T-work7000
11.0 W/m·K
Extreme Series
N800A
9.0 W/m·K
Low outgassing
T-top81-s
8.0 W/m·K
Extreme Series

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LiPOLY® Advance TIMs

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