RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Thermal Gap Pads

Thermal pads are solid insulating materials with high-efficiency heat dissipation performance. They work by filling the microscopic air gaps formed by surface roughness between heat-generating components and heat sinks, significantly reducing contact thermal resistance. LiPOLY offers thermal pads in a variety of specifications — samples are available upon request.

超高導熱墊片

Ultra3065 Ultra-High Thermal Conductivity Insulating Gap Filler Pad

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s High Thermal ConductiveGap Filler Pad

24.0 W/m·K
High Thermal Conductive
T-work9000 矽膠導熱片可依需求客製化厚度與沖型

T-work9000 High Thermal ConductiveGap Filler Pad

20.0 W/m·K
High Thermal Conductive
T-top98-s 超高導熱墊片

T-top98-s High Thermal ConductiveGap Filler Pad

18.0 W/m·K
High Thermal Conductive
極高導熱矽膠片T-work8000

T-work8000 High Thermal ConductiveGap Filler Pad

15.0 W/m·K
High Thermal Conductive
T-top91-s 極高導熱係數導熱片

T-top91-s High Thermal ConductiveGap Filler Pad

13.0 W/m·K
High Thermal Conductive
T-work7000 熱阻抗 vs. 壓力值 vs. 變形量

T-work7000 High Thermal ConductiveGap Filler Pad

11.0 W/m·K
High Thermal Conductive
超高導熱係數墊片T-top81-s

T-top81-s High Thermal ConductiveGap Filler Pad

8.0 W/m·K
High Thermal Conductive
PK700導熱矽膠片

PK700 Thermal Conductive Gel Pad

7.0 W/m·K
General
DTT61-s 是相容於單相浸沒式液冷的導熱墊片，經Engineered Fluids認證可長期耐受浸沒環境、不會污染冷卻液、維持高導熱特性，同時可兼具局部隔離效果，能為電子元件提供額外防護層，提升系統整體穩定性，可以客製化尺寸與裁切沖型。

DTT61-s Immersion Cooling Thermal Conductive Pad

6.0 W/m·K
Immersion Cooling
PK605 導熱片

PK605 Thermal Conductive Gel Pad

6.0 W/m·K
General
導熱矽膠PK504可根據客戶需求沖型，客製化厚度、硬度

PK504 Thermal Conductive Gel Pad

5.0 W/m·K
General
n800d

N800D Non-Silicone Thermal Conductive Pad

23.0 W/m·K
Low outgassing

N800C Non-Silicone Thermal Conductive Pad

17.0 W/m·K
Low outgassing
不含矽的導熱墊片（Non-Silicone Thermal Pad），稱作非矽型導熱墊片，是專為避免矽氧烷（Siloxane）揮發及矽油析出問題而設計，適合對矽敏感的產品應用，如光學、醫療、精密電子等領域。雖然成本較高，但能有效避免矽型材料帶來的污染與故障風險。

N800CH Non-Silicone Thermal Conductive Pad

15.0 W/m·K
Low outgassing

N800B Non-Silicone Thermal Conductive Pad

13.0 W/m·K
Low outgassing

N800BH Non-Silicone Thermal Conductive Pad

11.0 W/m·K
Low outgassing

N800A-s Non-Silicone Thermal Conductive Pad

9.0 W/m·K
Low outgassing
LiPOLY PCM900 是一款兼具 9.0 W/m·K 高導熱係數與卓越製程便利性的相變化材料。室溫下呈固態，免去點膠設備；當工作溫度達約 45°C 時軟化並緊密貼合熱源與散熱器，最小 BLT 僅 25 µm（24 µm），能顯著降低熱阻，為高功率電子設備提供穩定高效的熱介面解決方案。

PCM900 High-Performance Phase Change Thermal Interface Material

9.0 W/m·K
Phase Change Materials

N800AH Non-Silicone Thermal Conductive Pad

7.0 W/m·K
Low outgassing

N700C Non-Silicone Thermal Conductive Pad

5.0 W/m·K
Low outgassing

N700B Non-Silicone Thermal Conductive Pad

3.0 W/m·K
Low outgassing
超高導熱墊片

Ultra3065 Ultra-High Thermal Conductivity Insulating Gap Filler Pad

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s High Thermal ConductiveGap Filler Pad

24.0 W/m·K
High Thermal Conductive
n800d

N800D Non-Silicone Thermal Conductive Pad

23.0 W/m·K
Low outgassing
T-work9000 矽膠導熱片可依需求客製化厚度與沖型

T-work9000 High Thermal ConductiveGap Filler Pad

20.0 W/m·K
High Thermal Conductive
T-top98-s 超高導熱墊片

T-top98-s High Thermal ConductiveGap Filler Pad

18.0 W/m·K
High Thermal Conductive

N800C Non-Silicone Thermal Conductive Pad

17.0 W/m·K
Low outgassing
極高導熱矽膠片T-work8000

T-work8000 High Thermal ConductiveGap Filler Pad

15.0 W/m·K
High Thermal Conductive
不含矽的導熱墊片（Non-Silicone Thermal Pad），稱作非矽型導熱墊片，是專為避免矽氧烷（Siloxane）揮發及矽油析出問題而設計，適合對矽敏感的產品應用，如光學、醫療、精密電子等領域。雖然成本較高，但能有效避免矽型材料帶來的污染與故障風險。

N800CH Non-Silicone Thermal Conductive Pad

15.0 W/m·K
Low outgassing

N800B Non-Silicone Thermal Conductive Pad

13.0 W/m·K
Low outgassing
T-top91-s 極高導熱係數導熱片

T-top91-s High Thermal ConductiveGap Filler Pad

13.0 W/m·K
High Thermal Conductive

N800BH Non-Silicone Thermal Conductive Pad

11.0 W/m·K
Low outgassing
T-work7000 熱阻抗 vs. 壓力值 vs. 變形量

T-work7000 High Thermal ConductiveGap Filler Pad

11.0 W/m·K
High Thermal Conductive

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.