Paste
Pad
Wave Absorption
Tape
Light
Electrical Insulation
Graphite
Break
New, Silicone・TIMs ——
DTT65-s Lightweight 5G mmWave Thermal Conductive Gel Pad
5.0W/m·K
Low Dk/Df
EMI Shielding is a composite material combining magnetic materials and silicone resin with dual thermal conductivity and electromagnetic absorption functions. It fills gaps between heat components and heat sinks, replacing air (0.024 W/m·K) to reduce thermal resistance and suppress chip interference on PCB boards.
CATEGORY
FEATURES
/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m·K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| Property | DTT65-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Pink | – | Visual |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.1 | g/cm³ | ASTM D792 |
| Hardness | 55 | Shore OO | ASTM D2240 |
| Water absorption | 0.005 | % | ASTM D570 |
| Application temperature | -60～180 | °C | – |
| RoHS & REACH | Compliant | – | – |
| [email protected] | |||
| Deflection @10 psi | 8 | % | ASTM D5470 modify |
| Deflection @20 psi | 11 | % | ASTM D5470 modify |
| Deflection @30 psi | 16 | % | ASTM D5470 modify |
| Deflection @40 psi | 21 | % | ASTM D5470 modify |
| Deflection @50 psi | 26 | % | ASTM D5470 modify |
| ELECTRICAL | |||
| Dielectric breakdown | 10 | KV/mm | ASTM D149 |
| Surface resistivity | >1012 | Ohm | ASTM D257 |
| Volume resistivity | >1013 | Ohm-m | ASTM D257 |
| Dielectric constant@2GHz Dk | 4.131 | – | ASTM D150 |
| Dielectric constant@6GHz Dk | 4.058 | – | ASTM D150 |
| Dielectric constant@10GHz Dk | 4.013 | – | ASTM D150 |
| Dissipation factor@2GHz Df | 0.00509 | – | ASTM D150 |
| Dissipation factor@6GHz Df | 0.00658 | – | ASTM D150 |
| Dissipation factor@10GHz Df | 0.00780 | – | ASTM D150 |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.350 | °C·in²/W | ASTM D5470 |
| Thermal impedance@20 psi | 0.342 | °C·in²/W | ASTM D5470 |
| Thermal impedance@30 psi | 0.323 | °C·in²/W | ASTM D5470 |
| Thermal impedance@40 psi | 0.302 | °C·in²/W | ASTM D5470 |
| Thermal impedance@50 psi | 0.281 | °C·in²/W | ASTM D5470 |
