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TPS5868
3.0 W/m·K
Encapsulants
TPS5868 is a two-part silicone thermally conductive potting compound with excellent flowability. It fills gaps between electronic modules to enhance heat dissipation and provide electrical insulation. After room-temperature curing, it offers dustproof, moisture-proof, shockproof, and thermally conductive protection. Widely used in LED modules, power modules, and automotive electronics.
CATEGORY
Encapsulants
FEATURES
CONFIGURATIONS
Thermally conductive potting compound TPS5868 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
- Automotive electronic devices
- Telecommunication hardware
- Computer and peripherals
- 5G base station & infrastructure
- Between a component and heat sink
- EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS5868 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White-A Gray-B | - | Visual |
| Resin Base | Silicone | - | - |
| A:B | 100:100 | - | - |
| Viscosity | 8.0 | Pa.s | ISO 3219 |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 5 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m·K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹² | Ohm-m | ASTM D257 |
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