RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

T-work9000

20.0 W/m·K
Extreme Series
Silicone thermal pad T-work9000 is a thermal management material specifically engineered for high-efficiency heat transfer, primarily designed to fill the gaps between heat-generating components and heat sinks. With excellent electrical insulation and compressibility, its flexible nature effectively fills microscopic gaps, increasing the thermal contact area and significantly enhancing heat dissipation performance. Custom cutting and die-cutting services are available. Suitable for electronics, LED, power supply equipment, and other applications requiring thermal management.

CATEGORY

FEATURES

  • Thermal Conductivity:20.0 W/m·K
  • High compression rate
  • Extremely low thermal impedance
  • Excellent insulator

CONFIGURATIONS

  • Sheets form
  • Die-cuts parts

TYPICAL APPLICATION

  • Between CPU and heat sink
  • Between a component and heat sink
  • Flat-panel displays
  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware
  • 5G base station & infrastructure
  • High-end Chip
Thermal Pads with Other Thermal Conductivity Ratings
Ultra-High Thermal Conductivity Thermal Pad

T-work9000 Thermal Resistance vs. Pressure vs. Compression

TYPICAL PROPERTIES

PROPERTY T-work9000 UNIT TEST METHOD
Color Brown - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 65 Shore OOO ASTM D2240
TML <0.1 % By LiPOLY
Application temperature -60~150 °C -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 20.0 W/m·K ASTM D5470
Thermal conductivity 12.0 W/m·K ISO 22007-2
Thermal impedance@10psi 0.110 °C-in²/ W ASTM D5470

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