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G3380B
3.2 W/m·K
Low minimum bond line
G3380B thermal paste achieves a thermal impedance of just 0.03 °C·in²/W (ASTM D5470, 50 psi), making it ideal for demanding thermal management applications such as CPUs, LEDs, and EV systems. Thermal impedance depends not only on thermal conductivity but also on application thickness — G3380B delivers ultra-thin coverage with outstanding thermal conductivity and minimal thermal resistance.
CATEGORY
FEATURES
- Thermal Conductivity:3.2 W/m·K
- Low Thermal Resistance
- Can be applied manually dispensed or screen printed
- Low minimum bond line
CONFIGURATIONS
- Tinplate Can:1kg
- Other sizes, colors, and customized specifications are available upon request. Please contact us at: [email protected]
TYPICAL APPLICATION
- LED appliance
- EV electric vehicle
- CPU and chip coolers
- Switching power supplies
- 5G base station & infrastructure
- Between any heat-generating component and heat sink
G3380 Thermal Paste Series
- G3380A：1.3 W/m·K(Non-silicone series G3380NA)
- G3380B：3.2 W/m·K(Non-silicone series G3380NJ)
- G3380K：4.5 W/m·K(Non-silicone series G3380NK)
- G3380T：6.0 W/m·K(Non-silicone series G3380NT)
What Is the Difference Between Silicone and Non-Silicone Thermal Paste?
Most thermal pastes are silicone-based. However, silicone releases siloxane at high temperatures, which in enclosed environments can adhere to electrical contacts and cause malfunctions. LiPOLY Technology has developed a non-silicone thermal paste that does not release low molecular weight siloxane. This contamination-free thermal paste has become the preferred choice for EU aerospace, military, and medical device industries. Feel free to browse our products, or contact us directly .
G3380 Non-Silicone Thermal Paste Series
TYPICAL PROPERTIES
| PROPERTY | G3380B | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 130 | Pa.s | ISO 3219 |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Bond Line Thickness | 33 | µm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.2 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.03 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 19.3 | °C-mm²/ W | ASTM D5470 |
