RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

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G3380B
3.2 W/m·K
Low minimum bond line
Thermal resistance isn't determined by conductivity alone — bond line thickness matters equally. G3380B thermal paste delivers a thermal resistance of just 0.03 °C·in²/W at a 33µm bond line thickness (ASTM D5470, 50psi), making it a reliable choice for demanding thermal management applications including CPUs, LEDs, and EV systems.
Datasheet Download

CATEGORY

FEATURES

/ Thermal conductivity: 3.2 W/m·K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line

CONFIGURATIONS

/ Tinplate Can:1kg
/ Other sizes, colors, and custom specifications are available upon request. Please contact:[email protected]

TYPICAL APPLICATION

/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink

 

G3380 Thermal Grease Series

thermal paste series

thermal paste G3380

TYPICAL PROPERTIES

PROPERTY G3380B UNIT TEST METHOD
Color Gray - Visual
Resin Base Silicone - -
Filler Non-Metal - -
Viscosity 130 Pa.s ISO 3219
Density 2.7 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond Line Thickness 33 µm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.2 W/m·K ASTM D5470
Thermal impedance@50psi 0.03 °C-in²/ W ASTM D5470
Thermal impedance@50psi 19.3 °C-mm²/ W ASTM D5470

Thermal Paste Related Products

Thermal paste plays a crucial role in computer cooling. When processors (CPUs) or graphics cards (GPUs) operate continuously, they generate a significant amount of heat. If cooling performance is insufficient, it not only affects the overall performance of the computer but may also lead to system instability or crashes due to overheating.
TT3000
6.0 W/m·K
Nano Thermal Grease
散熱膏G3380T
G3380T
6.0 W/m·K
Low minimum bond line
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m·K
Low minimum bond line
散熱膏G3380B
G3380B
3.2 W/m·K
Low minimum bond line
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
G3380A
1.3 W/m·K
Low minimum bond line

Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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