RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicon-Free Thermal Gel

Non-silicone thermal putty differs from traditional silicone oil-based thermal materials in that it contains no silicone oil, thus eliminating the risk of low-molecular-weight siloxane volatilization and preventing electrical contact failures. Thermal putty can fill uneven surfaces and remain fixed for long periods without detachment, making it the best choice for applications with larger gaps. It is commonly used in industries such as memory modules, automotive, and robotics.

Thermal Conductive Putty
7.0 W/m·K
Low outgassing
No Vertical Flow
5.0 W/m·K
Low outgassing
No Vertical Flow
3.5 W/m·K
Low outgassing
No Vertical Flow
7.0 W/m·K
Low outgassing
No Vertical Flow
5.0 W/m·K
Low outgassing
No Vertical Flow
3.5 W/m·K
Low outgassing
No Vertical Flow
7.0 W/m·K
Low outgassing
No Vertical Flow
5.0 W/m·K
Low outgassing
No Vertical Flow
3.5 W/m·K
Low outgassing
No Vertical Flow

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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News | N-putty5, N700C & N800 Series non-silicone thermal materials meet ASTM E595 requirements. See datasheets.