RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

PK700

7.0 W/m·K
General Series
Thermal pad PK700 is a high-efficiency thermal interface material designed to reduce interfacial thermal resistance between heat sources and heat sinks. It is widely used in applications requiring heat dissipation, including M.2 SSD, CPU, and GPU cooling. LiPOLY Technology's thermal pads are available in multiple models, all compliant with RoHS and REACH. They offer exceptional flexibility, compressibility, electrical insulation, and self-adhesive properties, effectively compensating for positive and negative mechanical tolerances. Custom cutting and die-cutting services are available, and the material is also suitable for medical devices and food machinery.

CATEGORY

FEATURES

  • Thermal Conductivity:7.0 W/m·K
  • Naturally tacky for ease of manufacture
  • Extremely low thermal impedance
  • Available in a range of thicknesses

CONFIGURATIONS

  • Roll form
  • Sheets form
  • Die-cuts parts

TYPICAL APPLICATION

  • Notebook computers
  • Heat pipe assemblies
  • Memory modules
  • TV hardware
  • Automotive electronics
  • Mobile devices
  • High speed mass storage drives
  • Set-top box
  • IP CAM
  • 5G base station & infrastructure
  • EV electric vehicle
Thermal Pads with Other Thermal Conductivity Ratings
Ultra-High Thermal Conductivity Thermal Pad

Thermal Resistance vs. Pressure vs. Deflection

PK700熱阻抗 vs. 壓力值 vs. 變形量

TYPICAL PROPERTIES

PROPERTY PK700 UNIT TEST METHOD
Color Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 55 Shore OO ASTM D2240
Application temperature -60~180 °C -
Dielectric breakdown 12 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 7.0 W/m·K ASTM D5470
Thermal impedance@10 psi 0.321 °C-in²/ W ASTM D5470
Thermal impedance@20 psi 0.288 °C-in²/ W ASTM D5470

Related Products

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