RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.

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N-putty5

9.0W/m·K
Low outgassing
ASTM E595

N-putty5 is a non-silicone thermally conductive material without volatilization of low molecular weight siloxanes and with low total volatile gas. With a thermal conductivity of 9.0 W/m·K, its high deformation capability can perfectly fill small air gaps to eliminate tolerances.

It can also overcome spillage and drying issues to maintain stable thermal conductivity, making it ideal for dispensing with dispensing robots. LiPOLY N-putty5 meets the requirements of ASTM E595, making it highly suitable for applications requiring high cleanliness and high reliability.
Datasheet Download

CATEGORY

Thermal Gel

FEATURES

  • Thermal conductivity:9.0 W/m·K
  • Bond line thickness:100~1500µm
  • Non-silicone resin materials
  • Designed to remove manufacturing toleran tolerand to remove manufacturing tolerances
  • Does not produce stress on delicate compon
  • No vertical flow
  • Dispensable for serial manufacture
  • For any high compression and low stress application

CONFIGURATIONS

  • Cartridges: 30ml, 55ml, 330ml
  • Bucket: 1kg, 25kg

TYPICAL APPLICATION

  • Between CPU and heat sink
  • Between a component and heat sink
  • High speed mass storage drives
  • Telecommunication hardware
  • Flat-panel displays
  • Set-top box
  • IP CAM
  • 5G base station & infrastructure
  • EV electric vehicle
N-putty3點膠機

TYPICAL PROPERTIES

PROPERTY N-putty5 UNIT TEST METHOD
Color Gray – Visual
Resin Base Non-Silicone – –
Viscosity 25,000 Pa·s DIN 53018
Flow Rate (30cc EFD tube, 2.35mm Orifice diameter, 90psi&60s) 11 g/min Internal Test Method
Density 3.3 g/cm3 ASTM D792
Application temperature -60～150 °C –
Bond Line Thickness 100～1500 µm –
Shelf Life 60 months – –
Total Mass Loss（TML） ≤ 1.0 % ASTM E595
Collected Volatile Condensable Materials （CVCM） ≤ 0.10 % ASTM E595
Water Vapor Regained（WVR） ≤ 0.02 % ASTM E595
ROHS & REACH Compliant – –
ELECTRICAL
Dielectric breakdown 12 kV/mm ASTM D149
Volume resistivity >1013 Ohm-m ASTM D257
THERMAL
Thermal conductivity 9.0 W/m·K ASTM D5470
Thermal impedance@10psi / 80°C 0.036 °C·in2/W ASTM D5470
Thermal impedance@30psi / 80°C 0.032 °C·in2/W ASTM D5470
Thermal impedance@50psi / 80°C 0.029 °C·in2/W ASTM D5470

Related Products

Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.

N-putty5

9.0 W/m·K
Low outgassing
ASTM E595
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.

N-putty3

7.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying.

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow

Contact Us


    Thermal Solutions Expert

    SHIU LI TECHNOLOGY CO., LTD.

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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    Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.