Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
N-putty3
7.0 W/m·K
Low outgassing
No Vertical Flow
非矽型導熱凝膠 N-putty3 熱傳導係數高達：7.0 W/m*K，具有無低分子矽氧烷揮發特性，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
CATEGORY
Thermal Gel
FEATURES
/ Thermal conductivity: 7.0 W/m·K
/ Bond line thickness：100~1500µm
/ It’s made by non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application
CONFIGURATIONS
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N-putty3 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Non-Silicone | - | - |
| Viscosity | 25000 | Pa.s | DIN 53018 |
| Flow Rate | 13 | g/min | By LiPOLY |
| Density | 3.4 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond Line Thickness | 100~1500 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 7.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10psi / 80°C | 0.041 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi / 80°C | 0.033 | °C-in²/ W | ASTM D5470 |
Related Products
N-putty5
9.0 W/m·K
Low outgassing
No Vertical Flow
N-putty3
7.0 W/m·K
Low outgassing
No Vertical Flow
N-putty2
5.0 W/m·K
Low outgassing
No Vertical Flow
N-putty
3.5 W/m·K
Low outgassing
No Vertical Flow