RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

T-top99-s

Breaking the Thermal Conductivity Barrier
Extreme Series
T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.

CATEGORY

FEATURES

  • Thermal Conductivity:24.0 W/m·K
  • High compression rate
  • Extremely low thermal impedance
  • Excellent insulator

CONFIGURATIONS

  • Sheets form
  • Die-cuts parts

TYPICAL APPLICATION

  • Between CPU and heat sink
  • Between a component and heat sink
  • Flat-panel displays
  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware
  • 5G base station & infrastructure
  • High-end Chip
Thermal Pads with Other Thermal Conductivity Ratings
Ultra-High Thermal Conductivity Thermal Pad

T-top99-s Thermal Resistance vs. Pressure vs. Compression

T-top99-s 熱阻抗 vs. 壓力值 vs. 變形量

TYPICAL PROPERTIES

PROPERTY T-top99-s UNIT TEST METHOD
Color Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 70 Shore OOO ASTM D2240
TML <0.1 % By LiPOLY
Application temperature -60~150 °C -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 24.0 W/m·K ASTM D5470
Thermal conductivity 15.0 W/m·K ISO 22007-2
Thermal impedance@10psi 0.085 °C-in²/ W ASTM D5470

Related Products

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    SHIU LI TECHNOLOGY CO.,LTD

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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    產品新訊|N700C、N800A、N800B、N800C 非矽型導熱墊片符合 ASTM E595 測試要求,詳細資訊請參閱規格書