Silicone・TIMs ——

T-top98-s

18.0 W/m·K

Extreme Series

The thermal pad T-top98-s is an extreme thermal conductivity silicone pad with a thermal conductivity of 18.0 W/m·K. Featuring excellent electrical insulation, compressibility, and flexibility, it is specifically designed for uneven surface applications, effectively filling microscopic gaps and reducing contact thermal resistance. With strong in-house R&D capabilities, Asuli Technology provides cutting-edge thermal management solutions on demand, meeting customers' specialized requirements for today's most advanced products.

Datasheet Download

FEATURES

Thermal Conductivity：18.0 W/m·K
High compression rate
Extremely low thermal impedance
Excellent insulator

CONFIGURATIONS

Sheets form
Die-cuts parts

TYPICAL APPLICATION

Between CPU and heat sink
Between a component and heat sink
Flat-panel displays
Power supplies
High speed mass storage drives
Telecommunication hardware
5G base station & infrastructure
High-end Chip

Thermal Pads with Other Thermal Conductivity Ratings

2 W/m·K：PK223
4 W/m·K：PK404
5 W/m·K：PK504
6 W/m·K：PK605
7 W/m·K：PK700

Ultra-High Thermal Conductivity Thermal Pad

8 W/m·K：T-top81-s
11 W/m·K：T-work7000
13 W/m·K：T-top91-s
15 W/m·K：T-work8000
18 W/m·K：T-top98-s
20 W/m·K：T-work9000
24 W/m·K：T-top99-s

T-top98-s Thermal Resistance vs. Pressure vs. Compression

TYPICAL PROPERTIES

PROPERTY	T-top98-s	UNIT	TEST METHOD
Color	Purple	-	Visual
Surface tack 2-side/1-side	2	-	-
Thickness	Customized	mm	ASTM D374
Density	3.3	g/cm³	ASTM D792
Hardness	65	Shore OOO	ASTM D2240
TML	<0.1	%	By LiPOLY
Application temperature	-60~150	°C	-
ROHS & REACH	Compliant	-	-
THERMAL
Thermal conductivity	18.0	W/m·K	ASTM D5470
Thermal conductivity	10.5	W/m·K	ISO 22007-2
Thermal impedance@10psi	0.149	°C-in²/ W	ASTM D5470