RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

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TT3000
6.0 W/m·K
Nano Thermal Grease
Solvent-free TT3000 Thermal Grease uses unique fillers to prevent pump-out. Its high conductivity and low resistance boost performance and extend product life.
Datasheet Download

CATEGORY

FEATURES

/ Thermal conductivity: 6.0 W/m·K
/ Excellent thermal conductivity
/ Stable, uniform compound for thermal performance
/ Formula can fill the gap at low pressure
/ High stability and reliability
/ Solvent-free formula
/ The product is qualified for ROHS and REACH

CONFIGURATIONS

/ Tinplate Can:1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ CPU and chip coolers
/ Switching power supplies
/ Between any heat-generating component and heat sink
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TT3000 UNIT TEST METHOD
Color White - Visual
Resin Base Silicone - -
Filler Non-Metal - -
Viscosity 300 Pa.s ISO 3219
Density 3.3 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond Line Thickness 10 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m·K ASTM D5470
Thermal impedance@50psi 0.007 °C-in²/ W ASTM D5470
Thermal impedance@50psi 5.0 °C-mm²/ W ASTM D5470

Thermal Paste Related Products

Thermal paste plays a crucial role in computer cooling. When processors (CPUs) or graphics cards (GPUs) operate continuously, they generate a significant amount of heat. If cooling performance is insufficient, it not only affects the overall performance of the computer but may also lead to system instability or crashes due to overheating.
TT3000
6.0 W/m·K
Nano Thermal Grease
散熱膏G3380T
G3380T
6.0 W/m·K
Low minimum bond line
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m·K
Low minimum bond line
散熱膏G3380B
G3380B
3.2 W/m·K
Low minimum bond line
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
G3380A
1.3 W/m·K
Low minimum bond line

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    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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