RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
ISO 45001
IECQ 080000

Lightweight Thermal Putty

Thermal conductive gel is a thermally conductive material specifically designed for high-efficiency heat transfer, primarily used to improve the thermal conduction efficiency between electronic components and heat sinks. Compared to traditional thermal paste, thermal conductive gel offers superior flexibility and compressibility, enabling it to effectively fill irregularly shaped surfaces and perfectly conform to gaps between various electronic components, ensuring maximum heat transfer efficiency. It is widely applied in thermal management fields including consumer electronics, LED lighting, telecommunications equipment, and automotive electronics. Non-silicone thermal conductive gel differs from traditional silicone oil-containing thermal materials as it contains no silicone oil, thus preventing the volatilization of low molecular weight siloxanes and avoiding electrical contact failures.

Thermal Putty

NL-putty10

10.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty06

6.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty04

4.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty10

10.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty06

6.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty04

4.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty10

10.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty06

6.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty04

4.0 W/m·K
Low outgassing
No Vertical Flow

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO.,LTD

Taoyuan City, Bade District, Yongfeng Road, No. 435

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

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