Paste
Pad
Absorber
Tape
Light
Insulator
Graphite
Break
G3380A
1.3 W/m·K
Low minimum bond line
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
CATEGORY
FEATURES
- Thermal Conductivity: 1.3 W/m·K
- Low thermal impedance
- Can be applied manually dispensed or screen printed
- Low minimum bond line
CONFIGURATIONS
- Tinplate Can:1kg
- Other sizes, colors, and custom specifications are available upon request. Please contact:[email protected]
TYPICAL APPLICATION
- LED Device
- EV electric vehicle
- CPU and chip coolers
- Switching power supplies
- 5G base station & infrastructure
- Between any heat-generating component and a heat sink
G3380 Thermal Paste Series
- G3380A：1.3 W/m·K(Non-silicone series G3380NA)
- G3380B：3.2 W/m·K(Non-silicone series G3380NJ)
- G3380K：4.5 W/m·K(Non-silicone series G3380NK)
- G3380T：6.0 W/m·K(Non-silicone series G3380NT)
What Is the Difference Between Silicone and Non-Silicone Thermal Paste?
Most thermal pastes are silicone-based. However, silicone releases siloxane at high temperatures, which in enclosed environments can adhere to electrical contacts and cause malfunctions. LiPOLY Technology has developed a non-silicone thermal paste that does not release low molecular weight siloxane. This contamination-free thermal paste has become the preferred choice for EU aerospace, military, and medical device industries. Feel free to browse our products, or contact us directly .
G3380 Non-Silicone Thermal Paste Series
TYPICAL PROPERTIES
| PROPERTY | G3380A | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Resin Base | Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 16.5 | Pa.s | ISO 3219 |
| Density | 2.2 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Bond Line Thickness | 55 | µm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.3 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.05 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 32.2 | °C-mm²/ W | ASTM D5470 |
