Paste
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Tape
Light
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Graphite
Break
G3380NA
1.3 W/m·K
Low outgassing
Low minimum bond line
G3380NA Non-Silicone Thermal Grease is a new type of thermal interface material that offers advantages over traditional silicone-based thermal grease, such as zero silicone oil volatilization, high thermal conductivity, and long-term stability. It prevents the decline in thermal performance and device damage caused by silicone oil migration, making it suitable for precision electronic components sensitive to silicone.
CATEGORY
FEATURES
- Thermal Conductivity: 1.3 W/m·K
- No Low Molecular Weight Siloxane Outgassing
- Low Thermal Resistance
- It can be preserved for 60 months under the condition of unopened and under room temperature 25℃.
CONFIGURATIONS
- Tinplate Can:1kg
- Other sizes, colors, and custom specifications are available upon request. Please contact:[email protected]
TYPICAL APPLICATION
- Between CPU and heat sink
- Switching power supplies
- LED appliance
- Between any heat-generating component and a heat sink
- 5G base station & infrastructure
- EV electric vehicle
G3380 Non-Silicone Thermal Paste Series
- G3380NA: 1.3 W/m·K (Silicone : G3380A)
- G3380NJ: 3.2 W/m·K (Silicone : G3380B)
- G3380NK: 4.5 W/m·K (Silicone : G3380K)
- G3380NT: 6.0 W/m·K (Silicone : G3380T)
What Is Non-Silicone Thermal Paste?
Non-silicone thermal paste does not release low molecular weight siloxane. This contamination-free material, which eliminates the risk of electrical contact failure, has gained widespread adoption across EU industries in recent years. LiPOLY Technology offers a complete product line of both silicone and non-silicone thermal pastes across various thermal conductivity ratings. Feel free to browse our products, or contact us directly .
旭立科技G3380非矽型散熱膏
TYPICAL PROPERTIES
| PROPERTY | G3380NA | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White | - | Visual |
| Resin Base | Non-Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 96 | ISO 3219 | |
| Density | 2.2 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond Line Thickness | 55 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.3 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.05 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 32.2 | °C-mm²/ W | ASTM D5470 |
Related Products
G3380NT
6.0 W/m·K
Low outgassing
Low minimum bond line
G3380NK
4.5 W/m·K
Low outgassing
Low minimum bond line
G3380NJ
3.2 W/m·K
Low outgassing
Low minimum bond line
G3380NA
1.3 W/m·K
Low outgassing
Low minimum bond line