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G3380NT
6.0 W/m·K
Low outgassing
Low minimum bond line
After applying thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heatsink, enabling efficient heat transfer and allowing the heat generated by the CPU to be quickly transmitted to the heatsink, thereby improving the overall cooling performance of the computer. G3380NT features a high thermal conductivity of 6.0 W/m*K, is free from low molecular weight siloxane volatilization, and will not cause electrical contact failure, making it suitable for use in optical products or sensitive electronic components.
CATEGORY
FEATURES
- Thermal Conductivity：6.0 W/m·K
- No Low Molecular Weight Siloxane Outgassing
- Low Thermal Resistance
- It can be preserved for 60 months under the condition of unopened and under room temperature 25℃.
CONFIGURATIONS
- Tinplate Can:1kg
- Other sizes, colors, and custom specifications are available upon request. Please contact:[email protected]
TYPICAL APPLICATION
- CPU and chip coolers
- Switching power supplies
- LED appliance
- Between any heat-generating component and heat sink
- 5G base station & infrastructure
- EV electric vehicle
G3380 Non-Silicone Thermal Paste Series
- G3380NA: 1.3 W/m·K (Silicone : G3380A)
- G3380NJ: 3.2 W/m·K (Silicone : G3380B)
- G3380NK: 4.5 W/m·K (Silicone : G3380K)
- G3380NT: 6.0 W/m·K (Silicone : G3380T)
What Is Non-Silicone Thermal Paste?
Non-silicone thermal paste does not release low molecular weight siloxane. This contamination-free material, which eliminates the risk of electrical contact failure, has gained widespread adoption across EU industries in recent years. LiPOLY Technology offers a complete product line of both silicone and non-silicone thermal pastes across various thermal conductivity ratings. Feel free to browse our products, or contact us directly .
G3380 Non-Silicone Paste Series
TYPICAL PROPERTIES
| PROPERTY | G3380NT | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Non-Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 146 | ISO 3219 | |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond Line Thickness | 30 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m·K | ASTM D5470 |
| Thermal impedance@50psi | 0.01 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 6.4 | °C-mm²/ W | ASTM D5470 |
Related Products
G3380NT
6.0 W/m·K
Low outgassing
Low minimum bond line
G3380NK
4.5 W/m·K
Low outgassing
Low minimum bond line
G3380NJ
3.2 W/m·K
Low outgassing
Low minimum bond line
G3380NA
1.3 W/m·K
Low outgassing
Low minimum bond line