RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Liquid Thermal Interface Materials

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty
5.0 W/m·K
Stable thermal performance at elevated temperatures.
4.5 W/m·K
Low minimum bond line
4.0 W/m·K
Stable thermal performance at elevated temperatures.
3.6 W/m·K
Fast Curing in room temperature
3.5 W/m·K
No Vertical Flow
3.5 W/m·K
No Vertical Flow
3.2 W/m·K
Low minimum bond line
2.2 W/m·K
Fast Curing in room temperature
1.3 W/m·K
Low minimum bond line
6.0 W/m·K
No Vertical Flow
6.0 W/m·K
Nano Thermal Grease
5.0 W/m·K
Fast Curing in room temperature
5.0 W/m·K
Stable thermal performance at elevated temperatures.
5.0 W/m·K
Low outgassing
No Vertical Flow
4.5 W/m·K
Low outgassing
Low minimum bond line
4.5 W/m·K
Low minimum bond line
4.0 W/m·K
Stable thermal performance at elevated temperatures.
3.6 W/m·K
Fast Curing in room temperature
3.5 W/m·K
No Vertical Flow
3.5 W/m·K
No Vertical Flow
3.5 W/m·K
Low outgassing
No Vertical Flow

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.