RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.

H-putty

3.5 W/m·K
No Vertical Flow

S-putty

3.5 W/m·K
No Vertical Flow
Thermal paste G3380B

G3380B

3.2 W/m·K
Low minimum bond line
Insulating Potting Compound TPS5868 — Two-Part Type

TPS5868

3.0 W/m·K
Encapsulants

PK223DM

2.2 W/m·K
Fast Curing in room temperature
馬達灌封膠TPS586外包裝

TPS586

1.5 W/m·K
Encapsulants
Thermal grease G3380A

G3380A

1.3 W/m·K
Low minimum bond line
tps589絕緣電子封膠

TPS589

0.8 W/m·K
Encapsulants

DTT55-s

5.0 W/m·K
Stable thermal performance at elevated temperatures.

PK605DM

5.0 W/m·K
Fast Curing in room temperature
N-putty2 是具有熱傳導係數：5.0W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

N-putty2

5.0 W/m·K
Low outgassing
No Vertical Flow
Thermal grease G3380K

G3380K

4.5 W/m·K
Low minimum bond line
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.

G3380NK

4.5 W/m·K
Low outgassing
Low minimum bond line

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature

S-putty

3.5 W/m·K
No Vertical Flow
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.

H-putty

3.5 W/m·K
No Vertical Flow
N-putty 是具有熱傳導係數：3.5 W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。

N-putty

3.5 W/m·K
Low outgassing
No Vertical Flow
G3380NJ散熱膏外包裝

G3380NJ

3.2 W/m·K
Low outgassing
Low minimum bond line
Thermal paste G3380B

G3380B

3.2 W/m·K
Low minimum bond line

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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