Single-Part Thermal Conductive Adhesive

Single-part thermally conductive adhesive is a silicone-based thermal material that combines high thermal conductivity, adhesion, conformity and electrical insulation. Its high viscosity and excellent dispensing performance fill small gaps between heat-generating components and heat sinks, metal housings or heat-spreading structures, accommodate assembly tolerances and form a stable, reliable bond after curing.
Their soft, compressible properties help reduce material extrusion and displacement while lowering mechanical stress on chips, PCBs and precision electronic components. The series supports automated dispensing and curing at room temperature or with heat for AI, HPC, data centers, optical communications, automotive electronics, power modules and other high-power devices.