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IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Non-silicone Encapsulants

Non-silicone PCB potting compounds, such as epoxy resin and polyurethane, offer excellent durability and protection for electronic components. Epoxy resin provides high hardness, chemical resistance, and temperature stability, ideal for industrial electronics. Polyurethane offers flexibility, UV resistance, and shock absorption, suitable for consumer electronics and mobile applications.

Potting Compound
2.5 W/m·K
Low outgassing
Encapsulants
2.5 W/m·K
Low outgassing
Encapsulants
2.5 W/m·K
Low outgassing
Encapsulants

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News | N-putty5, N700C & N800 Series non-silicone thermal materials meet ASTM E595 requirements. See datasheets.