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Non-silicone Encapsulants

Non-silicone PCB potting compounds, such as epoxy resin and polyurethane, offer excellent durability and protection for electronic components. Epoxy resin provides high hardness, chemical resistance, and temperature stability, ideal for industrial electronics. Polyurethane offers flexibility, UV resistance, and shock absorption, suitable for consumer electronics and mobile applications.

Encapsulants

EP770

2.5 W/m·K
Low outgassing
Encapsulants

EP770

2.5 W/m·K
Low outgassing
Encapsulants

EP770

2.5 W/m·K
Low outgassing
Encapsulants

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SHIU LI TECHNOLOGY CO.,LTD

Taoyuan City, Bade District, Yongfeng Road, No. 435

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

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