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Non-silicone Encapsulants

Non-silicone PCB potting compounds, such as epoxy resin and polyurethane, offer excellent durability and protection for electronic components. Epoxy resin provides high hardness, chemical resistance, and temperature stability, ideal for industrial electronics. Polyurethane offers flexibility, UV resistance, and shock absorption, suitable for consumer electronics and mobile applications.

Encapsulants
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.

EP770

2.5 W/m·K
Low outgassing
Encapsulants
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.

EP770

2.5 W/m·K
Low outgassing
Encapsulants
PCB encapsulation resin is a protective material used to coat or encase printed circuit boards (PCBs). This process, also known as potting, safeguards PCBs from environmental hazards like moisture, vibration, shock, and contaminants. The resin creates a barrier, enhancing the PCB's reliability and lifespan.

EP770

2.5 W/m·K
Low outgassing
Encapsulants

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.