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Phase Change Materials

This series of phase change materials (PCM) remains solid at room temperature, making it suitable for automated assembly and handling. When the phase change temperature is reached, the material softens and flows, allowing an ultra-thin bond line thickness (BLT) to fully fill microscopic gaps on contact surfaces and significantly reduce interfacial thermal resistance. With excellent resistance to pump-out and dry-out, it delivers thermal performance comparable to high-end thermal grease while maintaining outstanding long-term reliability.

LiPOLY PCM900 is a phase change material that combines a high thermal conductivity of 9.0 W/m·K with excellent process convenience. It remains solid at room temperature, eliminating the need for dispensing equipment. When the operating temperature reaches approximately 45°C, it softens and closely conforms to the heat source and heat sink. With a minimum BLT of only 25 µm (24 µm), it significantly reduces thermal resistance and provides a stable, high-efficiency thermal interface solution for high-power electronic devices.

PCM900

9.0 W/m·K
Phase Change Materials
LiPOLY PCM900 is a phase change material that combines a high thermal conductivity of 9.0 W/m·K with excellent process convenience. It remains solid at room temperature, eliminating the need for dispensing equipment. When the operating temperature reaches approximately 45°C, it softens and closely conforms to the heat source and heat sink. With a minimum BLT of only 25 µm (24 µm), it significantly reduces thermal resistance and provides a stable, high-efficiency thermal interface solution for high-power electronic devices.

PCM900

9.0 W/m·K
Phase Change Materials
LiPOLY PCM900 is a phase change material that combines a high thermal conductivity of 9.0 W/m·K with excellent process convenience. It remains solid at room temperature, eliminating the need for dispensing equipment. When the operating temperature reaches approximately 45°C, it softens and closely conforms to the heat source and heat sink. With a minimum BLT of only 25 µm (24 µm), it significantly reduces thermal resistance and provides a stable, high-efficiency thermal interface solution for high-power electronic devices.

PCM900

9.0 W/m·K
Phase Change Materials

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.