Exhibition
Total of 5 articles
Evaluating thermal management in electronic systems often requires considering thermal performance, interface contact, material contamination risks, and electromagnetic interference together. At electronica 2026 in Munich, LiPOLY will showcase N800D non-silicone high-conductivity thermal pads, PCM900 phase change materials, and DTT18 thermal conductive RF absorber putty. We invite R&D engineers, procurement professionals, and project managers to discuss material selection and validation requirements based on their actual design conditions.
To address the dual bottlenecks of high heat generation and high-frequency electromagnetic interference (EMI) caused by high-density packaging in semiconductors and electronic equipment, LiPOLY will showcase breakthrough materials at NEPCON Japan 2026 that combine high thermal conductivity with high-frequency wave absorption, helping engineers eliminate electromagnetic noise and reduce thermal resistance.
LiPOLY will showcase two innovative thermal management materials at Techno Frontier 2026: the AS27-s Thermal Insulation Pad and the T-top99-s High Thermal Conductive Gap Filler, helping engineers solve challenges in thermal insulation, heat dissipation, and system reliability.
LiPOLY will present advanced Thermal Interface Materials designed for AI computing applications at PCIM Europe 2026, featuring Immersion Cooling Thermal Conductive Pads and high-performance Non-Silicone Thermal Conductive Pads.
As the demand for AI computing continues to grow, heat dissipation has become a critical aspect of server and data center development[cite: 1]. COMPUTEX Taipei 2026 showcases a variety of advanced thermal management technologies, including liquid cooling, immersion cooling, and high-performance thermal interface materials, reflecting the industry's high regard for energy efficiency and system reliability