News
Total of 27 articles
LiPOLY N800D is a low-volatility thermal pad formulated with a non-silicone resin system, offering a high thermal conductivity of 23.0 W/m·K, a dielectric strength of 8.5 kV/mm, and a hardness of Shore OO 70. Its flexibility and compressibility allow it to conform to uneven contact surfaces, providing thermal conduction and electrical insulation while reducing mechanical stress. It is well suited for applications with stringent requirements for cleanliness, reliability, and contamination control.
The "D3–D10" notation on material spec sheets — and the "D20" range some test reports extend to — refers to low molecular weight cyclic siloxanes. This article explains their chemical structure, why they volatilize, how they relate to electrical contact failure, and how gas chromatography testing works and why its range extends further — written for readers without a chemistry background.
Power density inside AI GPU modules keeps climbing, pushing the GPU, HBM, and VRM ever closer to their thermal design limits. This article focuses on GPU chip-level TIM, examining how PCM900 phase change material works and the reliability data behind it.
Package warpage and component height variation can raise HBM junction temperature and trigger thermal throttling. This article explains how gap filler materials address this challenge and reviews Ultra3065's specifications and reliability data.
Ultra3065 delivers a high thermal conductivity of 30.0 W/m·K. Its excellent compressibility and conformability accommodate component height variations and uneven surfaces, while Shore OOO 65 hardness balances surface conformity with mechanical support.
It also provides excellent electrical insulation, with a dielectric breakdown strength of 9 kV/mm, making it suitable for high-density electronic assemblies. Custom thicknesses and dimensions are available for AI servers, GPUs, CPUs, HBM packages, power modules, and other high-power applications.
To address the dual bottlenecks of high heat generation and high-frequency electromagnetic interference (EMI) caused by high-density packaging in semiconductors and electronic equipment, LiPOLY will showcase breakthrough materials at NEPCON Japan 2026 that combine high thermal conductivity with high-frequency wave absorption, helping engineers eliminate electromagnetic noise and reduce thermal resistance.
LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.
Optical module power is rising fast — TIM selection must now balance thermal performance with optical surface cleanliness. This article explains the siloxane contamination mechanism and offers non-silicone pad/putty selection guidance.
As AI computing, millimeter-wave communications, and high-speed data transmission are integrated into drone platforms, thermal management and electromagnetic interference have become critical design challenges. This article examines thermal EMI absorber applications in AI computing, mmWave radar, communication, and optical modules, including the value of non-silicone materials in reducing the risk of siloxane-related contamination.
Aerospace electronic systems must address both heat dissipation from high-power components and high-frequency electromagnetic interference (EMI). This article explains how thermal conductive RF absorbers work, the performance requirements for aerospace environments, typical application scenarios, and how to choose between silicone and non-silicone materials.
LiPOLY will showcase two innovative thermal management materials at Techno Frontier 2026: the AS27-s Thermal Insulation Pad and the T-top99-s High Thermal Conductive Gap Filler, helping engineers solve challenges in thermal insulation, heat dissipation, and system reliability.
LiPOLY will present advanced Thermal Interface Materials designed for AI computing applications at PCIM Europe 2026, featuring Immersion Cooling Thermal Conductive Pads and high-performance Non-Silicone Thermal Conductive Pads.