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Total of 31 articles
Ultra18PT-s is a Single-Part Thermal Conductive Adhesive with thermal conductivity of 18.0 W/m·K, low thermal impedance, electrical insulation and automated dispensing capability for AI, HPC, data centers, automotive electronics and power modules.
Ultra18PT-s is a Single-Part Thermal Conductive Adhesive with thermal conductivity of 18.0 W/m·K, low thermal impedance, electrical insulation and automated dispensing capability for AI, HPC, data centers, automotive electronics and power modules.
Evaluating thermal management in electronic systems often requires considering thermal performance, interface contact, material contamination risks, and electromagnetic interference together. At electronica 2026 in Munich, LiPOLY will showcase N800C non-silicone high-conductivity thermal pads, PCM900 phase change materials, and DTT18 thermal conductive RF absorber putty. We invite R&D engineers, procurement professionals, and project managers to discuss material selection and validation requirements based on their actual design conditions.
Excerpt: Explore the material-science mechanisms that cause silicone thermal pads to swell in immersion cooling fluids and discover LiPOLY’s DTT54-s / DTT55-s / DTT56-s / DTT61-s thermal materials for immersion cooling.
LiPOLY N800D is a low-volatility thermal pad formulated with a non-silicone resin system, offering a high thermal conductivity of 23.0 W/m·K, a dielectric strength of 8.5 kV/mm, and a hardness of Shore OO 70. Its flexibility and compressibility allow it to conform to uneven contact surfaces, providing thermal conduction and electrical insulation while reducing mechanical stress. It is well suited for applications with stringent requirements for cleanliness, reliability, and contamination control.
The "D3–D10" notation on material spec sheets — and the "D20" range some test reports extend to — refers to low molecular weight cyclic siloxanes. This article explains their chemical structure, why they volatilize, how they relate to electrical contact failure, and how gas chromatography testing works and why its range extends further — written for readers without a chemistry background.
Power density inside AI GPU modules keeps climbing, pushing the GPU, HBM, and VRM ever closer to their thermal design limits. This article focuses on GPU chip-level TIM, examining how PCM900 phase change material works and the reliability data behind it.
Package warpage and component height variation can raise HBM junction temperature and trigger thermal throttling. This article explains how gap filler materials address this challenge and reviews Ultra3065's specifications and reliability data.
Ultra3065 delivers a high thermal conductivity of 30.0 W/m·K. Its excellent compressibility and conformability accommodate component height variations and uneven surfaces, while Shore OOO 65 hardness balances surface conformity with mechanical support.
It also provides excellent electrical insulation, with a dielectric breakdown strength of 9 kV/mm, making it suitable for high-density electronic assemblies. Custom thicknesses and dimensions are available for AI servers, GPUs, CPUs, HBM packages, power modules, and other high-power applications.
To address the dual bottlenecks of high heat generation and high-frequency electromagnetic interference (EMI) caused by high-density packaging in semiconductors and electronic equipment, LiPOLY will showcase breakthrough materials at NEPCON Japan 2026 that combine high thermal conductivity with high-frequency wave absorption, helping engineers eliminate electromagnetic noise and reduce thermal resistance.
LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.
Optical module power is rising fast — TIM selection must now balance thermal performance with optical surface cleanliness. This article explains the siloxane contamination mechanism and offers non-silicone pad/putty selection guidance.