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Non-silicone two-component thermal adhesive is a type of thermally conductive adhesive that effectively transfers heat from electronic components to heat sinks, ensuring devices operate within the proper temperature range. Unlike thermal paste, thermal adhesive is tacky and can bond two surfaces together while also providing thermal conductivity.
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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.


