Material Selection

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First determine the heat-source power, contact area, gap range, assembly pressure, operating temperature, and electrical requirements. Then select a thermal pad, liquid material, thermally conductive tape, graphite sheet, phase change material, or thermal insulation material according to the mechanical structure. Thermal conductivity alone should not determine the selection.

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Liquid materials fill irregular surfaces, complex structures and larger tolerances and are suitable for automated dispensing. Thermal pads offer easier control of thickness and shape, cleaner installation, and quick application and replacement.

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Thermal adhesive tape provides double-sided adhesion and mounting for cooling structures with small gaps and flat surfaces. Thermal pads are thicker and compressible, making them better suited to component height differences and mechanical tolerances.

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Phase change materials are solid sheets at room temperature and support direct cutting, placement and automated assembly. They soften and wet the interface only after heating. Thermal grease flows at room temperature and fills gaps effectively, but requires dispensing equipment and volume control, with greater attention to pump-out, overflow and process cleanliness.

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Phase change materials suit flat surfaces and very small gaps, forming an ultra-thin BLT after phase change for low interface thermal resistance. Thermal gap pads fill larger height differences and mechanical tolerances while providing cushioning and compressibility.

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Generally, they cannot directly replace thermal pads. Graphite sheets rapidly spread heat across the plane to reduce localized hot spots, whereas thermal pads fill gaps and transfer heat toward the heat sink. The two materials are often used together.

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Consider synthetic graphite when an ultra-thin profile and high in-plane thermal conductivity are required. Consider natural graphite when multiple thickness options, large-area temperature uniformity, or a broader range of operating conditions are needed. If structural support, dimensional stability, or EMI shielding is also required, consider graphite-copper sheets.

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Caps and sleeves are preformed three-dimensional structures that directly cover specific components for fast, stable positioning. Flat materials are thinner and offer greater cutting flexibility for flat interfaces, large areas and custom shapes.

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Consider polyimide when thinness, high-temperature resistance and lower thermal resistance are priorities. Consider fiberglass reinforcement for surfaces with burrs, higher fastening pressure, large areas or complex die-cut shapes.

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Insulation felt uses a high-temperature fiber structure for industrial heat and fire barriers. Foam is very soft and compressible for tolerance compensation, cushioning and vibration protection. Sheets provide low conductivity, low weight and controlled dimensions for precision die-cutting and slim electronics.

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Consider insulation sheets for low heat transfer, thin construction and precision die-cutting between cells. Choose foam when module tolerances and vibration must also be absorbed. Evaluate felt for extremely high temperatures or fire barriers.

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Standard thermal materials mainly fill interface gaps and transfer heat. Thermal EMI absorbers also contain magnetic or dielectric-loss fillers that absorb and attenuate electromagnetic waves within specific frequency bands. They are suitable for equipment requiring both heat dissipation and EMI control.

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Choose a pad for fixed gaps, regular flat surfaces, precise shape control and convenient rework. Gel is more suitable for large height variations, irregular surfaces, fragile components and automated dispensing.

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For general equipment, select the material based on thermal performance, softness, temperature resistance, and cost. Near optical components or precision contacts, or in vacuum environments and contamination-sensitive areas, prioritize silicone-free and low-outgassing materials.

Thermal Performance

Does higher thermal conductivity always mean better cooling?

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Not necessarily. Actual cooling also depends on thickness, contact thermal resistance, surface flatness and fastening pressure. A thin, well-conformed material may outperform a thicker material with higher conductivity.

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Thermal conductivity indicates a material’s inherent ability to conduct heat. Thermal resistance reflects how much the material restricts heat flow under a specific thickness, area, pressure, and set of test conditions. Thermal conductivity alone is not sufficient when evaluating actual interface performance.

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With all other conditions being equal, thermal resistance generally increases as the distance heat must travel increases. Therefore, unnecessary thickness should be avoided as long as the material can completely fill the gap and maintain proper contact.

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Initial thickness is the sheet thickness before installation. BLT is the final interface thickness between the heat source and heat sink after phase change and compression. Actual BLT is a key factor when evaluating thermal resistance.

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Measure the minimum and maximum gaps and account for mechanical tolerances. Choose a thickness that maintains full contact after compression. A pad that is too thin leaves gaps; one that is too thick may increase thermal resistance and assembly pressure.

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No. Ultra-soft materials can reduce assembly stress and accommodate tolerances, but may be harder to handle, more prone to displacement or less suitable for automated assembly. Select hardness according to component pressure limits, pad area and assembly method.

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Base compression on the product specification, hardness, gap tolerance and pressure the components can withstand. Too little compression reduces contact; too much may bend the PCB, damage components or deform the material excessively.

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Select thickness according to contact-surface flatness, roughness, assembly tolerances and required BLT. The material must provide complete contact but should not be used to fill significant gaps. Available thicknesses and forms vary by product.

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The phase change temperature should be lower than the interface temperature during normal equipment operation so the material can soften sufficiently and wet the contact surfaces. Cold starts, low-load operation, and ambient temperature must also be considered.

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A graphite sheet primarily spreads heat rapidly across the XY plane to reduce localized hotspots. Transferring heat across a gap along the Z axis to a heat sink generally requires a thermal pad or liquid interface material.

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Consider the available mechanical space, handling strength, bending requirements, and heat-spreading area. Synthetic graphite can be evaluated for ultra-thin applications. Natural graphite or graphite-copper sheets can be considered when greater rigidity or a wider range of thicknesses is required.

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Adhesive backing increases interfacial thermal resistance but can improve positioning and mass-production assembly. Select the adhesive-layer thickness according to thermal and assembly requirements, and avoid adding unnecessary thermal resistance solely for easier installation.

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No. A thinner material may reduce thermal resistance but can also reduce puncture resistance and the insulation safety margin. Burrs, protrusions or uneven pressure may make an excessively thin material more likely to fail.

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The reinforcement layer may affect material thickness and the heat-transfer structure, but it can improve puncture resistance, dimensional stability, and processing strength. Compare the actual thermal resistance of the complete material rather than considering only whether fiberglass is present.

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No. Greater thickness generally slows heat penetration but also consumes space, may interfere with assembly and changes compression. Select thickness according to the allowable temperature rise, installation gap and equipment weight.

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No. Proper compression fills the gap and secures the material, but excessive compression reduces effective insulation thickness and may cause permanent deformation. Set compression according to the product recommendation and actual tolerances.

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Not necessarily. Thickness may change the material’s effective absorption frequency range and increase the heat-transfer distance and assembly pressure. Consider the target frequency, thermal resistance, gap and allowable component pressure together.

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Material & Electrical Safety

Are All Thermal Management Materials Electrically Insulating?

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No. Electrical properties vary by material. Graphite and some wave-absorbing materials containing conductive fillers may even be electrically conductive. Check the dielectric breakdown voltage, volume resistivity, material thickness, and actual operating voltage.

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No. Dielectric strength is measured per unit thickness. Actual withstand voltage also depends on thickness, processed edges, humidity, aging and the safety factor.

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Silicone-free materials do not use silicone resin and are primarily intended to eliminate the risk of volatile low-molecular-weight siloxanes. Low-bleed materials may still use silicone formulations but reduce oil separation under high temperatures or compression. The two are not interchangeable.

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Fiberglass-reinforced tape offers better dimensional stability and is easier to die-cut, handle and position. Non-reinforced tape is more conformable and can accommodate small surface variations, but must be protected from stretching and deformation during processing and placement.

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No. Absorber materials dissipate electromagnetic energy within the material to reduce reflection, coupling and resonance. Shielding materials generally use conductive structures to reflect or redirect electromagnetic energy. The two may be used together but are not directly interchangeable.

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First measure the problem frequency, noise source and intended material location. Then compare absorption data obtained using the same test method. Do not select a material solely by its maximum listed frequency or its best attenuation value.

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Possibly. If the material is too close to an antenna, RF circuit, or high-speed signal area, it may alter impedance, resonance, or signal strength. Confirm the installation position and dimensions through simulation or sample testing.

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Direct application without evaluation is not recommended. Graphite is conductive, so confirm the safety clearance and add PET, insulating film or edge protection where needed to prevent short circuits.

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PET improves surface insulation and handling strength while reducing graphite particles. However, it also increases material thickness and interfacial thermal resistance. Its use should be determined according to electrical-safety and thermal requirements.

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Not necessarily. This depends on the EMI-shielding objective and mechanical design. If the copper foil is used as a shielding layer, appropriate grounding is generally required; otherwise, it may not provide the expected performance.

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No. High-temperature resistance indicates a material’s ability to operate at a specified temperature. Flame retardancy describes its burning behavior. For UL certification, the certified category, model, and applicable thickness must be confirmed. Each should be verified separately.

Installation & Processing

Is lower viscosity always better?

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Not necessarily. Low viscosity supports flow and small-gap filling but may cause overflow. High viscosity retains its shape and is better suited to vertical surfaces or localized dispensing.

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One-part products can generally be dispensed directly and use a simpler process. Two-part products require ratio-controlled mixing and may provide curing, bonding or potting functions, but place greater demands on equipment and process control.

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Set the volume according to the contact area, gap, compressed thickness and allowable overflow, then verify it through sample trials. Too little material leaves voids; too much may contaminate nearby components.

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Not always. Some putties and gap fillers can be used without curing. Bonding adhesives, potting compounds and certain two-part materials may require room-temperature or heat curing.

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It depends on the material type. Low-adhesion, uncured, or preformed materials are generally easier to rework. Cured adhesives and potting compounds may be difficult to remove, and phase change materials are not recommended for reuse after compression.

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Self-adhesion improves positioning and assembly, but excessive adhesion may make rework more difficult. Select a single-sided, double-sided, or low-tack design according to manual or automated installation, vertical mounting, and maintenance requirements.

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Self-adhesion helps with positioning, especially in vertical installation or preassembly processes. However, excessive adhesion makes removal and rework more difficult. Select single-sided, double-sided, or non-adhesive specifications according to the process.

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Tape may be used directly for small, lightweight heat sinks. Large or heavy heat sinks, vertical installations and high-vibration structures still require mechanical mounting and reliability validation.

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Standard thin thermal adhesive tape is suitable only for flat surfaces and small variations. Use a thermal pad or liquid gap filler when the gap or component height difference is significant.

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Remove dust, oil, moisture, and adhesive residue first, and confirm that the surface is dry and intact. Surface contamination may reduce contact and adhesion and may also increase interfacial thermal resistance.

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Repeated removal and reapplication are not recommended. Reapplication may reduce adhesion, deform the material, or leave adhesive residue. If regular maintenance is required, plan the removal method during material selection.

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Graphite sheets can follow a reasonable bend radius, but should not be repeatedly folded at a sharp angle along the same line. Excessive bending may cause cracks, delamination, or reduced thermal performance.

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Some preformed caps can simplify the assembly of pads and washers, but suitability must be confirmed for the actual structure. Additional insulation may still be required if screws, fasteners, or component leads create other conductive paths.

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It depends on the product structure. Adhesive backing improves positioning, but the adhesive layer’s temperature resistance, volatility, thickness, and long-term adhesion must also be evaluated. Mechanical clamping may be more suitable for extremely high-temperature environments.

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Reliability & Environment

Content] Can Standard Thermal Materials Be Used Directly in Immersion Cooling?

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Use without prior validation is not recommended. Coolants may cause swelling, leaching, changes in weight or hardness, loss of adhesion, and degradation of thermal performance. Select materials that have passed compatibility and long-term immersion testing.

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In addition to the maximum operating temperature, verify the duration of high-temperature exposure and changes in hardness, dimensions, adhesion, compression set, and thermal resistance after thermal cycling. Do not rely only on the maximum temperature listed in the datasheet.

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Repeated temperature changes may cause material displacement, hardening, cracking, delamination, oil bleeding, loss of adhesion, or increased interfacial gaps. Validate the material according to the equipment’s temperature range and expected number of cycles.

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No. Pump-out resistance indicates better stability under thermal cycling and pressure changes, but actual performance is still affected by temperature, pressure, interface dimensions, installation orientation, and mechanical design.

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Dry-out occurs when a liquid or semi-liquid interface material gradually dries during prolonged high-temperature use because of evaporation, component separation, or material aging. This reduces surface contact and increases thermal resistance.

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Common causes include surface contamination, insufficient bonding pressure, an excessively heavy heat sink, high-temperature aging, differences in thermal expansion, low surface energy, and prolonged equipment vibration.

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Confirm the material’s adhesion, slip resistance, compression retention, and mechanical fastening method. Heavy heat sinks and large materials should not be secured solely by the material’s adhesion.

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It must be evaluated individually. Cutting or rubbing the fibrous surface may generate lint. For equipment with strict cleanliness requirements, use edge sealing or encapsulation, or select a material with a more intact surface.

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No. All materials transfer some heat; the differences are the transfer rate and amount of heat flow. Thermal insulation materials delay and reduce heat transfer rather than stopping it completely.

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Yes. The material still conducts heat, but below its phase change temperature it may not soften sufficiently, wet the surfaces, or eliminate microscopic gaps. Its interfacial thermal resistance may therefore be higher than after the phase change is complete.

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Generally, no. Thermally conductive EMI absorbers are one part of the thermal-interface and EMI-control system. They must still be designed together with suitable heat sinks, metal enclosures, grounding, filtering, and PCB layout.

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Testing, Certification & Quality

Can Thermal Conductivity Values from Different Test Methods Be Compared Directly?

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Direct comparison is not recommended. The test method, sample thickness, temperature, pressure, and equipment settings may all affect the result. First confirm that the test standards and conditions are consistent.

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Thermal conductivity can be used for an initial comparison of the materials’ inherent heat-transfer capability. For actual selection, measure thermal resistance under conditions close to the intended thickness, pressure, and temperature, and conduct temperature-rise testing on the actual equipment.

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Datasheet values are generally obtained under specific laboratory conditions. Differences in material thickness, assembly pressure, surface roughness, heat-source area, cooling structure, and ambient temperature in the actual equipment may produce different results.

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Using the actual heat source, heat sink, gap, fastening pressure, and operating voltage, conduct temperature-rise, thermal-cycling, withstand-voltage, and post-disassembly inspections. Check the material for displacement, damage, hardening, embrittlement, or delamination.

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ASTM E595 is a test method for evaluating mass loss and collected volatile condensable materials in a vacuum environment. It is commonly used in aerospace, optical, and contamination-sensitive applications. Compliance must be confirmed using the test data for each product.

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Confirm the test standard, flame rating, certified model, applicable thickness, and material construction. Different thicknesses or adhesive-backed versions may not be covered by the same certification results.

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RoHS and REACH address requirements for specified hazardous substances and chemicals. Safety data describes product hazards and precautions for handling and storage. These documents do not replace performance and reliability testing.

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Conduct withstand-voltage testing based on the material’s actual thickness, operating voltage, electrode shape, ambient humidity, and safety factor. Add thermal-aging, damp-heat, or post-compression testing when necessary.

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Check the material’s weight, dimensions, hardness, appearance, adhesion, and thermal performance before and after immersion. Also observe whether it causes coolant contamination, precipitation, or color changes.

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Relevant technical information may be provided according to the product and project requirements. If the customer specifies a test standard, operating condition, or validation format, raise the requirement early in the project.

Samples, Customization & Delivery

How Can I Request Material Samples?

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Use the contact form on the website to provide the material type, application equipment, gap, operating temperature, and required quantity. The relevant team will confirm a suitable material and specification.

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Provide the heat-source power, contact area, gap range, operating temperature, assembly pressure, electrical requirements, processing method, and any special environmental conditions. More complete information enables more accurate material selection.

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Standard samples may be available in as little as three days. Actual timing depends on material inventory, dimensions, processing requirements, and shipping destination.

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Depending on the material type, customization may include thickness, hardness, dimensions, holes, custom die-cut shapes, adhesive backing, and release-liner design. Processing limitations vary by material and require engineering and process confirmation.

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Custom development may be evaluated according to requirements for thermal performance, hardness, insulation, silicone-free composition, low outgassing, wave absorption, or special environments.

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Use samples or a small-volume trial run to confirm material performance, processing tolerances, handling, and assembly in the actual equipment. Then adjust the specifications or process according to the test results.

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The minimum order quantity varies according to whether the product is standard or customized, its dimensions, die-cutting method, raw materials, and packaging requirements. Confirm it based on the actual product and project conditions.

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Standard products may ship in as little as approximately ten days. Lead times for custom formulations, special thicknesses, die-cut parts, or projects requiring additional testing depend on the development and production schedule.

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Provide the test conditions, temperature-rise results, disassembly photos, and assembly details. The engineering team can assess whether to adjust the material type, thickness, hardness, compression ratio, or installation method.

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Use the website contact page to provide the application equipment, currently used material, problem encountered, and target specifications. Providing structural drawings, gap dimensions, temperatures, and test results can accelerate the evaluation.

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