RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

New

超高導熱墊片

Ultra3065 Ultra-High Thermal Conductivity Insulating Gap Filler Pad

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s High Thermal ConductiveGap Filler Pad

24.0 W/m·K
High Thermal Conductive
PK700導熱矽膠片

PK700 Thermal Conductive Gel Pad

7.0 W/m·K
General

TEM96E Thermal Conductive EMI/RF Absorber Pad

6.0 W/m·K
Thermal & Absorber
DTT61-s 是相容於單相浸沒式液冷的導熱墊片，經Engineered Fluids認證可長期耐受浸沒環境、不會污染冷卻液、維持高導熱特性，同時可兼具局部隔離效果，能為電子元件提供額外防護層，提升系統整體穩定性，可以客製化尺寸與裁切沖型。

DTT61-s Immersion Cooling Thermal Conductive Pad

6.0 W/m·K
Immersion Cooling

DTT56-s Two-Part Thermal Conductive Die Attach Adhesive

6.0 W/m·K
Stable thermal performance at elevated temperatures.

TEM96D Thermal Conductive EMI/RF Absorber Pad

5.0 W/m·K
Thermal & Absorber
DTT65-s

DTT65-s Lightweight 5G mmWave Thermal Conductive Gel Pad

5.0 W/m·K
Low Dk/Df

AS50-s Fiberglass-Reinforced Thermal Gap Pad

5.0 W/m·K
Fiberglass reinforced
DTT65-s

DTT65-s Lightweight 5G mmWave Thermal Conductive Gel Pad

5.0 W/m·K
Lightweight

DTT55-s Two-Part Thermal Conductive Die Attach Adhesive

5.0 W/m·K
Stable thermal performance at elevated temperatures.

DCTP140-s High Insulated Thermal Conductive Pad

4.5 W/m·K
Fiberglass reinforced
n800d

N800D Non-Silicone Thermal Conductive Pad

23.0 W/m·K
Low outgassing

N800C Non-Silicone Thermal Conductive Pad

17.0 W/m·K
Low outgassing

AS17-s Thermal Insulation Felt

0.028 W/m·K
INDUSTRIAL

AS28-s Thermal Insulation Foam

0.028 W/m·K
ELECTRONICS

AS27-s Thermal Insulation Pad

0.012 W/m·K
ELECTRONICS
超高導熱墊片

Ultra3065 Ultra-High Thermal Conductivity Insulating Gap Filler Pad

30.0 W/m·K
Ultra High Thermal Conductive
T-top99-s

T-top99-s High Thermal ConductiveGap Filler Pad

24.0 W/m·K
High Thermal Conductive
n800d

N800D Non-Silicone Thermal Conductive Pad

23.0 W/m·K
Low outgassing

N800C Non-Silicone Thermal Conductive Pad

17.0 W/m·K
Low outgassing
PK700導熱矽膠片

PK700 Thermal Conductive Gel Pad

7.0 W/m·K
General

DTT56-s Two-Part Thermal Conductive Die Attach Adhesive

6.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT61-s 是相容於單相浸沒式液冷的導熱墊片，經Engineered Fluids認證可長期耐受浸沒環境、不會污染冷卻液、維持高導熱特性，同時可兼具局部隔離效果，能為電子元件提供額外防護層，提升系統整體穩定性，可以客製化尺寸與裁切沖型。

DTT61-s Immersion Cooling Thermal Conductive Pad

6.0 W/m·K
Immersion Cooling

TEM96E Thermal Conductive EMI/RF Absorber Pad

6.0 W/m·K
Thermal & Absorber

AS50-s Fiberglass-Reinforced Thermal Gap Pad

5.0 W/m·K
Fiberglass reinforced

DTT55-s Two-Part Thermal Conductive Die Attach Adhesive

5.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT65-s

DTT65-s Lightweight 5G mmWave Thermal Conductive Gel Pad

5.0 W/m·K
Lightweight
DTT65-s

DTT65-s Lightweight 5G mmWave Thermal Conductive Gel Pad

5.0 W/m·K
Low Dk/Df

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SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.