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Ultra-high thermal conductivity pads offer excellent thermal performance, compressibility, and conformability. They effectively fill gaps between heat-generating components and cooling modules, making them suitable for thermal management in AI servers, GPUs, CPUs, power modules, and other high-power electronic equipment.
Thermal Solutions Expert
SHIU LI TECHNOLOGY CO., LTD.
Taoyuan City, Bade District, Yongfeng Road, No. 435
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News | N-putty5, N700C & N800 Series non-silicone thermal materials meet ASTM E595 requirements. See datasheets.


