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Ultra-high thermal conductivity pads offer excellent thermal performance, compressibility, and conformability. They effectively fill gaps between heat-generating components and cooling modules, making them suitable for thermal management in AI servers, GPUs, CPUs, power modules, and other high-power electronic equipment.
Thermal Solutions Expert
SHIU LI TECHNOLOGY CO., LTD.
Taoyuan City, Bade District, Yongfeng Road, No. 435
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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.


