Thermal Pad

High-performance silicone-free thermal pads exhibit excellent elasticity, compressibility, and moderate adhesion, with thermal conductivity ranging from 2.5 to 17.0 W/mK. These pads effectively fill gaps between contact surfaces, eliminate air pockets, and facilitate efficient heat transfer to heat sinks or external environments. Reducing interfacial thermal resistance to 0.06-0.84°C-in²/W as measured by ASTM D5470 standards.