Paste
Pad
Absorber
Tape
Light
Insulator
Graphite
Break
New, Non-Silicone・TIMs ——
N800C
17.0 W/m·K
Low outgassing
ASTM E595
Non-silicone thermal pads do not cause electrical contact or contamination issues. With the core advantage of “zero silicone contamination,” they have become an irreplaceable choice for sensitive applications in optics, medical, and semiconductor fields. As the electronics industry advances toward higher integration, higher power, and greater precision, the demand for non-silicone thermal pads will shift from being a “silicone material alternative” to an “essential solution for specific high-end applications.”
CATEGORY
FEATURES
/ 熱傳導係數： 17.0 W/m・K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
/aerospace
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ High speed mass storage drives
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | N800C | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | – |
| Surface tack 2-side/1-side | 2 | – | – |
| Thickness | Customized | ASTM D374 | mm |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Hardness | 50 | ASTM D2240 | Shore OO |
| Application temperature | -60~125 | – | °C |
| Low molecular Siloxane(D3 to D20 total) | N.D | Gas Chromatography | % |
| Total Mass Loss (TML ≤ 1.0%) | 0.0448 | ASTM E595 | % |
| Outgassing CVCM ≤ 0.10%) | 0.0264 | ASTM E595 | % |
| Water Vapor Regained | N.D. | ASTM E595 | % |
| ROHS & REACH | Compliant | – | – |
| [email protected] | |||
| Deflection @10 psi | 8 | ASTM D5470 modify | % |
| Deflection @20 psi | 28 | ASTM D5470 modify | % |
| Deflection @30 psi | 55 | ASTM D5470 modify | % |
| ELECTRICAL | |||
| Dielectric breakdown | 8 | ASTM D149 | KV/mm |
| Surface resistivity | >1011 | ASTM D257 | Ohm |
| Volume resistivity | >1010 | ASTM D257 | Ohm-m |
| THERMAL | |||
| Thermal conductivity | 17.0 | ASTM D5470 | W/m·K |
| Thermal impedance@10 psi | 0.122 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@20 psi | 0.103 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@30 psi | 0.058 | ASTM D5470 | °C-in²/ W |
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