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PCM900
CATEGORY
FEATURES
/ High thermal conductivity and ultra-low thermal resistance:Thermal conductivity of 9.0 W/m·K, phase change at 45°C, and thermal resistance as low as 0.0051 °C-in²/W (@50 psi).
/ Excellent gap-filling capability:Minimum Bond Line Thickness (BLT) can reach 25 µm (24 µm), with excellent wettability to fully fill microscopic surface roughness.
/ High reliability and pump-out resistance:Formulated with a stable phase change matrix, it resists pump-out and dry-out during long-term use, with an operating temperature range of -60~150°C.
/ Good electrical insulation:Surface and volume resistivity are both >10¹² Ohm / Ohm-m, providing electrical insulation suitable for high-power and high heat-flux applications.
/ Process- and assembly-friendly:Can be handled directly at room temperature without dispensing equipment, and is available in Roll, Sheet, and Die-cut parts formats.
CONFIGURATIONS
/ Roll form / Sheet form
/ Die-cuts parts
TYPICAL APPLICATION
AI / HPC: AI servers, GPUs
/ Data Center：Server、Network
/ Consumer：PC、SSD、Game Console
/ Power：Power Module、Power Supply
/ Automotive：ECU、BMS、OBC
FEATURES
TYPICAL PROPERTIES
| Properties | PCM900 | UNIT | TEST METHOD | ||
|---|---|---|---|---|---|
| Color | Gray | – | Visual | ||
| Surface tack 2-side/1-side | 2 | – | – | ||
| Phase Change Temperature | 45 | °C | – | ||
| Thickness | 0.15 | 0.20 | 0.25 | mm | ASTM D374 |
| Density | 2.70 | 2.70 | 2.70 | g/cm³ | ASTM D792 |
| Bond line thickness | 25 | 25 | 25 | μm | – |
| Application temperature | -60~150 | -60~150 | -60~150 | °C | – |
| ROHS | Compliant | Compliant | Compliant | – | – |
| ELECTRICAL @ 1.0mm | |||||
| Surface resistivity | >1012 | Ohm | ASTM D257 | ||
| Volume resistivity | >1012 | Ohm-m | ASTM D257 | ||
| Dielectric constant@10MHz Dk | 17.7 | – | ASTM D150 | ||
| Dissipation factor@10MHz Df | 0.096 | – | ASTM D150 | ||
| THERMAL | |||||
| Thermal conductivity | 9.0 | 9.0 | 9.0 | W/m*K | ASTM D5470 |
| Thermal impedance@50 psi | 0.0051 | 0.0056 | 0.0062 | °C-in²/W | ASTM D5470 |
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