RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

PCM900

9.0W/m·K
Phase Change Materials
LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.

CATEGORY

FEATURES

  • Thermal conductivity: 9.0 W/m·K , 45°C phase change, low thermal resistance
  • Min. BLT 24 μm, good wettability, gap filling
  • High reliability, pump-out resistant
  • Room-temp application, no dispensing required
  • Electrical insulation, high-power applications

CONFIGURATIONS

  • Roll form / Sheet form
  • Die-cuts parts

TYPICAL APPLICATION

  • AI / HPC: AI servers, GPUs
  • Data Center:Server、Network
  • Consumer:PC、SSD、Game Console
  • Power:Power Module、Power Supply
  • Automotive:ECU、BMS、OBC

Thermal Impedance vs Pressure

PCM900

TYPICAL PROPERTIES

PROPERTY PCM900 UNIT TEST METHOD
Color Gray Visual
Surface tack 2-side/1-side 2
Phase Change Temperature 45 °C
Thickness 0.15 0.20 0.25 mm ASTM D374
Density 2.70 2.70 2.70 g/cm³ ASTM D792
Bond line thickness 25 25 25 μm
Application temperature -60~150 -60~150 -60~150 °C
ROHS Compliant Compliant Compliant
ELECTRICAL @ 1.0mm
Surface resistivity >1012 Ohm ASTM D257
Volume resistivity >1012 Ohm-m ASTM D257
Dielectric constant@10MHz Dk 17.7 ASTM D150
Dissipation factor@10MHz Df 0.096 ASTM D150
THERMAL
Thermal conductivity 9.0 9.0 9.0 W/m*K ASTM D5470
Thermal impedance@50 psi 0.0051 0.0056 0.0062 °C-in²/W ASTM D5470

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