RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

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G3380NA
1.3 W/m·K
Low outgassing
Low minimum bond line
G3380NA Non-Silicone Thermal Grease is a new type of thermal interface material that offers advantages over traditional silicone-based thermal grease, such as zero silicone oil volatilization, high thermal conductivity, and long-term stability. It prevents the decline in thermal performance and device damage caused by silicone oil migration, making it suitable for precision electronic components sensitive to silicone.
Datasheet Download

CATEGORY

FEATURES

/ Thermal conductivity: 1.3 W/m·K
/ Low outgassing
/ Low thermal impedance
/ It can be preserved for 60 months under the condition of unopened and under room temperature 25℃.

CONFIGURATIONS

/ Tinplate Can:1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Switching power supplies
/ LED appliance
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle

G3380NT

TYPICAL PROPERTIES

PROPERTY G3380NA UNIT TEST METHOD
Color White - Visual
Resin Base Non-Silicone - -
Filler Non-Metal - -
Viscosity 96 ISO 3219
Density 2.2 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond Line Thickness 55 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 1.3 W/m·K ASTM D5470
Thermal impedance@50psi 0.05 °C-in²/ W ASTM D5470
Thermal impedance@50psi 32.2 °C-mm²/ W ASTM D5470

Thermal Paste Related Products

G3380NT Non-silicone thermal grease with a thermal conductivity of 6.0 W/m*K, featuring zero low-molecular-weight siloxane volatilization to prevent electrical contact failure. Ideal for optical products and sensitive electronic components, it offers extremely low thermal resistance and excellent thermal conductivity.
G3380NT
6.0 W/m·K
Low outgassing
Low minimum bond line
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.
G3380NK
4.5 W/m·K
Low outgassing
Low minimum bond line
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m·K
Low outgassing
Low minimum bond line
G3380NA Non-Silicone Thermal Grease is a new type of thermal interface material that offers advantages over traditional silicone-based thermal grease, such as zero silicone oil volatilization, high thermal conductivity, and long-term stability. It prevents the decline in thermal performance and device damage caused by silicone oil migration, making it suitable for precision electronic components sensitive to silicone.
G3380NA
1.3 W/m·K
Low outgassing
Low minimum bond line

Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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