RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

PK700導熱矽膠片

PK700

7.0 W/m·K
General

PK700DM

7.0 W/m·K
Fast Curing in room temperature
DTT61-s is a thermal pad compatible with single-phase immersion cooling, certified by Engineered Fluids for long-term immersion environment resistance. It prevents coolant contamination and maintains high thermal conductivity characteristics while providing local isolation effects that offer an additional protective layer for electronic components, enhancing overall system stability. Customizable sizing and die-cutting are available.

DTT61-s

6.0 W/m·K
Single-Phase Immersion Cooling
Thermal grease TT3000

TT3000

6.0 W/m·K
Nano Thermal Grease
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.

H-putty2

6.0 W/m·K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.

S-putty2-s

6.0 W/m·K
No Vertical Flow
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.

DTT06-s

6.0 W/m·K
No Vertical Flow

DTT56-s

6.0 W/m·K
Stable thermal performance at elevated temperatures.
PK605 導熱片

PK605

6.0 W/m·K
General

TEM96E

6.0 W/m·K
Thermal & Absorber
Thermal grease G3380T

G3380T

6.0 W/m·K
Low minimum bond line

TEM96D

5.0 W/m·K
Thermal & Absorber
DTT18-s 是一款單組分點膠式導熱吸波材料，採用將軟磁性吸收介質均勻分散於高分子樹脂中的配方設計，兼具導熱與電磁波吸收能力。材料可將電磁輻射轉化為熱能並快速耗散，有助於降低 EMI、提升系統穩定性與可靠性。DTT18 導熱係數為 5.0 W/m*K，具備良好的柔順性與變形能力，可填補微小氣隙與不規則界面，降低接觸熱阻，適用於同時需要散熱與電磁干擾抑制的高頻電子應用。

DTT18-s

5.0 W/m·K
Thermal & Absorber

DTT44-s

3.0 W/m·K
Lightweight

DTT44-s

3.0 W/m·K
Low Dk/Df

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT55-s

5.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT56-s

6.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT61-s is a thermal pad compatible with single-phase immersion cooling, certified by Engineered Fluids for long-term immersion environment resistance. It prevents coolant contamination and maintains high thermal conductivity characteristics while providing local isolation effects that offer an additional protective layer for electronic components, enhancing overall system stability. Customizable sizing and die-cutting are available.

DTT61-s

6.0 W/m·K
Single-Phase Immersion Cooling

DTT65-s

5.0 W/m·K
Low Dk/Df

DTT65-s

5.0 W/m·K
Lightweight
Thermal grease G3380A

G3380A

1.3 W/m·K
Low minimum bond line
Thermal paste G3380B

G3380B

3.2 W/m·K
Low minimum bond line
Thermal grease G3380K

G3380K

4.5 W/m·K
Low minimum bond line

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.