RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

8.0 W/m·K
High Thermal Conductive
8.0 W/m·K
No Vertical Flow
7.0 W/m·K
Fast Curing in room temperature
6.0 W/m·K
Low minimum bond line
6.0 W/m·K
Thermal & Absorber
6.0 W/m·K
Nano Thermal Grease
6.0 W/m·K
No Vertical Flow
6.0 W/m·K
No Vertical Flow
4.0 W/m·K
Stable thermal performance at elevated temperatures.
5.0 W/m·K
Stable thermal performance at elevated temperatures.
6.0 W/m·K
Stable thermal performance at elevated temperatures.
1.3 W/m·K
Low minimum bond line
3.2 W/m·K
Low minimum bond line
4.5 W/m·K
Low minimum bond line

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.