RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

PK700

7.0 W/m·K
General Series

DTT06-s

6.0 W/m·K
No Vertical Flow

PK605

6.0 W/m·K
General Series

DTT56-s

6.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT61-s

6.0 W/m·K
Single-Phase Immersion Cooling

G3380T

6.0 W/m·K
Low minimum bond line

TEM96E

6.0 W/m·K
Thermal & Absorber

TT3000

6.0 W/m·K
Nano Thermal Grease

H-putty2

6.0 W/m·K
No Vertical Flow

S-putty2-s

6.0 W/m·K
No Vertical Flow

PK605DM

5.0 W/m·K
Fast Curing in room temperature

BS89-s

5.0 W/m·K
Shore OO/25

DTT44-s

3.0 W/m·K
Low Dk/Df

DTT44-s

3.0 W/m·K
Lightweight

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT55-s

5.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT56-s

6.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT61-s

6.0 W/m·K
Single-Phase Immersion Cooling

DTT65-s

5.0 W/m·K
Lightweight

DTT65-s

5.0 W/m·K
Low Dk/Df

G3380A

1.3 W/m·K
Low minimum bond line

G3380B

3.2 W/m·K
Low minimum bond line

G3380K

4.5 W/m·K
Low minimum bond line

G3380T

6.0 W/m·K
Low minimum bond line

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

View Datasheet