RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Lightweight Potting

Low-density electronic potting compounds enhance durability, moisture resistance, and thermal conductivity while maintaining excellent electrical insulation. They protect critical components, extend service life, and improve product competitiveness across diverse applications.

PCB Encapsulation
Thermally Conductive Encapsulant is a lightweight potting compound. It can improve the performance of PCB boards or power supplies and reduce energy consumption, commonly applied in aerospace and automotive electronic equipment. With a thermal conductivity of 1.50 W/m*K, it fills the gaps in the air space surrounding electronic devices, maintaining close contact with heat-generating electronic components and heat sinks after curing, allowing electronic products to operate under high power for heat conduction. It significantly enhances product reliability, service life, and reduces the risk of damage from external environments.

TPS32

1.5 W/m·K
Encapsulants
PCB Encapsulant TPS31 is a low-density electronic encapsulation material. By pouring the compound onto PCB boards and between electronic components, and allowing it to cure, it forms long-term and effective waterproofing, electrical insulation, and protection. It is used for general encapsulation, power module encapsulation, and various sensor encapsulations.

TPS31

0.55 W/m·K
Encapsulants
PCB Encapsulant TPS31 is a low-density electronic encapsulation material. By pouring the compound onto PCB boards and between electronic components, and allowing it to cure, it forms long-term and effective waterproofing, electrical insulation, and protection. It is used for general encapsulation, power module encapsulation, and various sensor encapsulations.

TPS31

0.55 W/m·K
Encapsulants
Thermally Conductive Encapsulant is a lightweight potting compound. It can improve the performance of PCB boards or power supplies and reduce energy consumption, commonly applied in aerospace and automotive electronic equipment. With a thermal conductivity of 1.50 W/m*K, it fills the gaps in the air space surrounding electronic devices, maintaining close contact with heat-generating electronic components and heat sinks after curing, allowing electronic products to operate under high power for heat conduction. It significantly enhances product reliability, service life, and reduces the risk of damage from external environments.

TPS32

1.5 W/m·K
Encapsulants
Thermally Conductive Encapsulant is a lightweight potting compound. It can improve the performance of PCB boards or power supplies and reduce energy consumption, commonly applied in aerospace and automotive electronic equipment. With a thermal conductivity of 1.50 W/m*K, it fills the gaps in the air space surrounding electronic devices, maintaining close contact with heat-generating electronic components and heat sinks after curing, allowing electronic products to operate under high power for heat conduction. It significantly enhances product reliability, service life, and reduces the risk of damage from external environments.

TPS32

1.5 W/m·K
Encapsulants
PCB Encapsulant TPS31 is a low-density electronic encapsulation material. By pouring the compound onto PCB boards and between electronic components, and allowing it to cure, it forms long-term and effective waterproofing, electrical insulation, and protection. It is used for general encapsulation, power module encapsulation, and various sensor encapsulations.

TPS31

0.55 W/m·K
Encapsulants

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO.,LTD

Taoyuan City, Bade District, Yongfeng Road, No. 435

Contact Us

Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.