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/Thermal conductivity: 5.0 W/m·K
/ Excellent electromagnetic wave absorption capability, effectively reducing EM
/ High flexibility and conformability, filling microscopic gaps
/ Reduces contact thermal resistance, improving heat dissipation efficiency
/ Good application stability, preventing overflow and drying issues
/ Suitable for high-compression and low-stress applications
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 6.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
| PROPERTY | DTT18-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | – | Visual |
| Resin base | Silicone | – | – |
| Viscosity | 6500 | Pa.s | DIN 53018 |
| 流速(30cc EFD 管,2.35mm 孔徑,90psi&60s) | 14 | g/min | Internal Test Method |
| Density | 3.6 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | – |
| Bond line thickness | 100~1500 | μm | – |
| Shelf Life | 60 months | – | – |
| ROHS & REACH | Compliant | – | – |
| EMI Attenuation @1.0mm | |||
| EMI Attenuation@ 2.4 GHz | 30.6 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 3.5 GHz | 27.5 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 5.0 GHz | 44.7 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 6.0 GHz | 46.2 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 12 GHz | 80.5 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 18 GHz | 99.8 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 28 GHz | 94.3 | dB/cm | ASTM D4935 modify |
| EMI Attenuation@ 39 GHz | 66.6 | dB/cm | ASTM D4935 modify |
| ELECTRICAL | |||
| Surface resistivity | >1011 | Ohm | ASTM D257 |
| Volume resistivity | >1010 | Ohm-m | ASTM D257 |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10psi / 60°C | 0.093 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30psi / 60°C | 0.082 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi / 60°C | 0.078 | °C-in²/ W | ASTM D5470 |
Thermal Solutions Expert
SHIU LI TECHNOLOGY CO., LTD.
Taoyuan City, Bade District, Yongfeng Road, No. 435
Contact Us
Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.


