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DTT18-s
5.0 W/m·K
Thermal & Absorber
DTT18-s is a one-component dispensable thermal absorbing material formulated by uniformly dispersing soft magnetic absorbing particles within a polymer matrix. It combines excellent thermal conductivity with electromagnetic wave absorption, converting electromagnetic radiation into heat for rapid dissipation. This effectively reduces EMI while enhancing overall system stability and reliability.
With a thermal conductivity of 5.0 W/m·K, DTT18-s offers excellent flexibility and conformability, enabling it to fill microscopic air gaps and irregular interfaces, thereby reducing thermal contact resistance. It is ideal for high-frequency electronic applications requiring both thermal management and EMI suppression.
CATEGORY
Thermal Gel
FEATURES
/Thermal conductivity: 5.0 W/m·K
/ Excellent electromagnetic wave absorption capability, effectively reducing EM
/ High flexibility and conformability, filling microscopic gaps
/ Reduces contact thermal resistance, improving heat dissipation efficiency
/ Good application stability, preventing overflow and drying issues
/ Suitable for high-compression and low-stress applications
CONFIGURATIONS
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
TYPICAL APPLICATION
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 6.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
EMI Attenuation
TYPICAL PROPERTIES
| PROPERTY | DTT18-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Dark Gray | Visual | – |
| Resin base | Silicone | – | – |
| Viscosity | 6500 | DIN 53018 | Pa.s |
| Flow Rate (30cc EFD tube, 2.35mm Orifice diameter, 90psi&60s) | 14 | Internal Test Method | g/min |
| Density | 3.6 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | – | °C |
| Bond line thickness | 100~1500 | – | μm |
| Shelf Life | 60 months | – | – |
| ROHS & REACH | Compliant | – | – |
| EMI Attenuation @1.0mm | |||
| EMI Attenuation@ 2.4 GHz | 30.6 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 3.5 GHz | 27.5 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 5.0 GHz | 44.7 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 6.0 GHz | 46.2 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 12 GHz | 80.5 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 18 GHz | 99.8 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 28 GHz | 94.3 | ASTM D4935 modify | dB/cm |
| EMI Attenuation@ 39 GHz | 66.6 | ASTM D4935 modify | dB/cm |
| ELECTRICAL | |||
| Dielectric breakdown | 12 | ASTM D149 | KV/mm |
| Volume resistivity | >1013 | ASTM D257 | Ohm-m |
| THERMAL | |||
| Thermal conductivity | 5.0 | ASTM D5470 | W/m・K |
| Thermal impedance@10psi / 60°C | 0.093 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@30psi / 60°C | 0.082 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi / 60°C | 0.078 | ASTM D5470 | °C-in²/ W |
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