Exhibition
共 3 篇文章
LiPOLY will showcase two innovative thermal management materials at Techno Frontier 2026: the AS27-s Thermal Insulation Pad and the T-top99-s High Thermal Conductive Gap Filler, helping engineers solve challenges in thermal insulation, heat dissipation, and system reliability.
LiPOLY will present advanced Thermal Interface Materials designed for AI computing applications at PCIM Europe 2026, featuring Immersion Cooling Thermal Conductive Pads and high-performance Non-Silicone Thermal Conductive Pads.
As the demand for AI computing continues to grow, heat dissipation has become a critical aspect of server and data center development[cite: 1]. COMPUTEX Taipei 2026 showcases a variety of advanced thermal management technologies, including liquid cooling, immersion cooling, and high-performance thermal interface materials, reflecting the industry's high regard for energy efficiency and system reliability