Polyimide Film

Polyimide film composite thermal pads are renowned for their excellent heat resistance, chemical resistance, high mechanical strength, and low dielectric constant. These characteristics make them an ideal choice for various high-tech applications, suitable for high-power electronic component heat dissipation that requires high stability and reliability, such as: high-power transistors, power supplies, motor control, power semiconductors, 5G base station equipment, and electric vehicles. Their outstanding insulation performance enables them to simultaneously meet both thermal management and insulation requirements.