RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

2-Part

Dual-component thermal conductive liquid materials are two-part systems requiring mixing before application. After curing, they provide excellent thermal conductivity, effectively transferring heat away from components.

These materials are commonly used to fill gaps between electronic components, improving heat dissipation and reducing operating temperatures.

7.0 W/m·K
Fast Curing in room temperature
6.0 W/m·K
Stable thermal performance at elevated temperatures.
5.0 W/m·K
Fast Curing in room temperature
5.0 W/m·K
Stable thermal performance at elevated temperatures.
4.0 W/m·K
Stable thermal performance at elevated temperatures.
3.6 W/m·K
Fast Curing in room temperature
2.2 W/m·K
Fast Curing in room temperature
7.0 W/m·K
Fast Curing in room temperature
6.0 W/m·K
Stable thermal performance at elevated temperatures.
5.0 W/m·K
Fast Curing in room temperature
5.0 W/m·K
Stable thermal performance at elevated temperatures.
4.0 W/m·K
Stable thermal performance at elevated temperatures.
3.6 W/m·K
Fast Curing in room temperature
2.2 W/m·K
Fast Curing in room temperature

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Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.