RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

2-Part

Dual-component thermal conductive liquid materials are two-part systems requiring mixing before application. After curing, they provide excellent thermal conductivity, effectively transferring heat away from components.

These materials are commonly used to fill gaps between electronic components, improving heat dissipation and reducing operating temperatures.

PK700DM

7.0 W/m·K
Fast Curing in room temperature

DTT56-s

6.0 W/m·K
Stable thermal performance at elevated temperatures.

PK605DM

5.0 W/m·K
Fast Curing in room temperature

DTT55-s

5.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature

TPS5868

3.0 W/m·K
Encapsulants

PK223DM

2.2 W/m·K
Fast Curing in room temperature

TPS586

1.5 W/m·K
Encapsulants

TPS589

0.8 W/m·K
Encapsulants

PK700DM

7.0 W/m·K
Fast Curing in room temperature

DTT56-s

6.0 W/m·K
Stable thermal performance at elevated temperatures.

PK605DM

5.0 W/m·K
Fast Curing in room temperature

DTT55-s

5.0 W/m·K
Stable thermal performance at elevated temperatures.

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature

TPS5868

3.0 W/m·K
Encapsulants

PK223DM

2.2 W/m·K
Fast Curing in room temperature

TPS586

1.5 W/m·K
Encapsulants

TPS589

0.8 W/m·K
Encapsulants

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LiPOLY® Advance TIMs

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

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