RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

DTT65-s

5.0 W/m·K
Low Dk/Df

TEM96D

5.0 W/m·K
Thermal & Absorber

PK504

5.0 W/m·K
General Series

DTT65-s

5.0 W/m·K
Lightweight

AS50-s

5.0 W/m·K
Fiberglass reinforced

DTT55-s

5.0 W/m·K
Stable thermal performance at elevated temperatures.

BS89-s

5.0 W/m·K
Shore OO/25

G3380K

4.5 W/m·K
Low minimum bond line

DCTP140-s

4.5 W/m·K
Fiberglass reinforced

AS02-s

4.5 W/m·K
厚度 0.15 / 0.20 mm

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404

4.0 W/m·K
General Series

G3380T

6.0 W/m·K
Low minimum bond line

H-putty

3.5 W/m·K
No Vertical Flow

H-putty2

6.0 W/m·K
No Vertical Flow

HC-93

2.5 W/m·K
TO220 / TO3P

PK223

2.0 W/m·K
General Series

PK223DM

2.2 W/m·K
Fast Curing in room temperature

PK404

4.0 W/m·K
General Series

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature

PK504

5.0 W/m·K
General Series

PK605

6.0 W/m·K
General Series

PK605DM

5.0 W/m·K
Fast Curing in room temperature

PK700

7.0 W/m·K
General Series

For all informaton you need

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.