RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Solid series

Explore LiPoly's full range of thermal gap fillers — silicone & non-silicone options for EV, AI server, aerospace & 5G applications. Request a sample today.

AS02-s
4.5 W/m·K
厚度 0.15 / 0.20 mm
PK404
4.0 W/m·K
General Series
AS400-s
4.0 W/m·K
Oil bleed width < 1mm
S818
3.2 W/m·K
Tensile strength 0.44 MPa
Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.
BS75K-s
3.0 W/m·K
Shore OO/18
BS87-s
3.0 W/m·K
Shore OO/10
S282-s
2.5 W/m·K
Fiberglass reinforced
S393
2.2 W/m·K
Tensile strength 0.75 MPa
AS200-s
2.0 W/m·K
Oil bleed width < 1mm
PK223
2.0 W/m·K
General Series
PK700 thermal pad is a thermal interface material (TIMs) designed to reduce thermal interface resistance between heat sources and heat sinks, with wide applications from CPU/GPU cooling to automotive electronics. Compliant with RoHS/REACH , it is also suitable for medical equipment/food machinery. With Shore OO/55 hardness, it offers excellent flexibility, compressibility, insulation properties, and available with customized cutting and die-cutting services.
PK700
7.0 W/m·K
General Series
N800AH
7.0 W/m·K
Low outgassing
PK605
6.0 W/m·K
General Series
PK504
5.0 W/m·K
General Series
AS50-s
5.0 W/m·K
Fiberglass reinforced
BS89-s
5.0 W/m·K
Shore OO/25
N700C
5.0 W/m·K
Low outgassing
AS02-s
4.5 W/m·K
厚度 0.15 / 0.20 mm
PK404
4.0 W/m·K
General Series
AS400-s
4.0 W/m·K
Oil bleed width < 1mm
S818
3.2 W/m·K
Tensile strength 0.44 MPa
Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.
BS75K-s
3.0 W/m·K
Shore OO/18

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LiPOLY® Advance TIMs

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